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MC14538BDW

Onsemi

MC14538BDW by Onsemi

MC14538BDW by Onsemi is a Prescaler & Multivibrator IC with 2 functions, operating at 5V. It has a propagation delay of 600ns and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring precise timing and signal processing.

Median Price

$0.467

Lifecycle Status

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35

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1k+

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Component Electronics Inc.

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AZTECH Wire

Italy . 280 parts In-Stock

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Singapore . 1,259 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

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Overview

Unlock the potential of your electronic projects with the MC14538BDW by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This versatile Prescaler & Multivibrator boasts a range of applications, making it a must-have component for any project. With a nominal supply voltage of 5V and dual functions, this product offers unmatched value and efficiency. Say goodbye to limitations and hello to endless possibilities with the MC14538BDW by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and allows for easy mounting and handling.

Surface Mount: YES

Makes it convenient for quick and efficient assembly on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common voltage standards, ensuring easy integration into existing systems.

No. of Terminals: 16

Sufficient terminals for connecting with other components and circuits.

Propagation Delay (tpd): 600 ns

Low propagation delay ensures quick response and high-speed operation.

Maximum Operating Temperature: 125 °C

Capable of withstanding high temperatures, making it suitable for a variety of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Prescaler & Multivibrators MC14538BDW attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC14538BDW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-419-1879, 5962014191879

NIIN

014191879

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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