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MC14021BCPG

Onsemi

MC14021BCPG by Onsemi

MC14021BCPG by Onsemi is an 8-bit digital shift register with a supply voltage of 5V, operating temperature range from -55 to 125 °C, and max frequency of 4MHz. It is used in military-grade applications requiring positive edge trigger type and true output polarity.

Median Price

$0.339

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Magnum Semiconductors LLP

India . 10,500 parts In-Stock

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Vyrian

USA . 6,229 parts In-Stock

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Digiode

USA . 1,545 parts In-Stock

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Component Sense

UK . 950 parts In-Stock

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Corohmni

South Africa . 445 parts In-Stock

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$0.339

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445

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AZTECH Wire

Italy . 1,078 parts In-Stock

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$16.850

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Infinite Electronics LLP (Excess)

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Kepictronics

USA . 10,500 parts In-Stock

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Kulean Microsystems

USA . 5,622 parts In-Stock

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SupplyDigital Components

Austria . 5,257 parts In-Stock

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TANS Electronics

Latvia . 4,741 parts In-Stock

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Problanco Electronics

Mexico . 3,801 parts In-Stock

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UHIMA Technologies

Türkiye . 830 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your digital circuit designs with the MC14021BCPG from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The MC14021BCPG is an 8-bit digital shift register that offers fast propagation delay and true output polarity, making it ideal for a wide range of applications. With a maximum frequency of 4MHz and military-grade temperature specifications, this shift register provides exceptional value and performance for your projects. Upgrade your designs today with the MC14021BCPG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the shift register.

No. of Bits: 8

Provides a decent amount of storage capacity for data within the shift register.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltage requirements, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Propagation Delay (tpd): 800 ns

Provides fast operation and response times for data shifting.

Trigger Type: POSITIVE EDGE

Allows for precise control over when data is shifted, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Maximum Frequency At Nominal Supply: 4000000 Hz

Can handle high-frequency operations, making it suitable for high-speed applications.

Technical Specifications

Digital Shift Registers MC14021BCPG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Additional Features:

OUTPUTS ALSO AVAILABLE AT 6TH AND 7TH STAGE OF THE SHIFT REGISTER

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

800 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

4 MHz

Trade Compliance

MC14021BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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