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SN74HC323NP3

Texas Instruments

SN74HC323NP3 by Texas Instruments

SN74HC323NP3 by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and features CMOS technology. This rectangular package with 20 terminals is ideal for applications requiring serial data transfer and storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,105 parts In-Stock

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8,105

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Digiode

USA . 3,378 parts In-Stock

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3,378

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Distributors (Availability)

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AZTECH Wire

Italy . 800 parts In-Stock

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$18.218

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800

$18.218

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Parana Technologies

USA . 2,299 parts In-Stock

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$19.535

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$19.538

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2,299

$19.535

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$19.538

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DigiPath Technology Company

USA . 404 parts In-Stock

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$21.510

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404

$21.510

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ChromeModa Solutions

Germany . 4,740 parts In-Stock

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$21.949

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$17.998

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4,740

$21.949

$17.998

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IDEA Electronic Components Group

UK . 790 parts In-Stock

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$21.949

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$20.852

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$19.754

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790

$21.949

$20.852

$19.754

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One Stop Electronics

USA . 1,339 parts In-Stock

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$51.000

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Corphita

USA . 804 parts In-Stock

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Overview

Unlock endless possibilities with the SN74HC323NP3 by Texas Instruments, a top-quality digital shift register that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for industrial-grade applications, ensuring seamless operation in any environment. With its 8-bit capacity and 5V nominal supply voltage, this shift register is perfect for a wide range of electronic projects. Experience the value and benefits of Texas Instruments technology with the SN74HC323NP3 - the ultimate solution for your digital circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the shift register, ensuring durability and reliability in various operating conditions.

No. of Bits: 8

Having 8 bits allows for a wide range of digital data storage and manipulation, making this shift register suitable for a variety of applications that require moderate data handling.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this shift register compatible with many standard digital systems, offering ease of integration and flexibility in design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this shift register can withstand elevated temperatures, making it suitable for industrial applications or harsh environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making this shift register energy-efficient and reliable in digital signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections and ease of soldering, ensuring secure and reliable electrical connections in the assembly of electronic circuits.

Technical Specifications

Digital Shift Registers SN74HC323NP3 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74HC323NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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