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MC14015BCL

Onsemi

MC14015BCL by Onsemi

MC14015BCL by Onsemi is a CMOS digital shift register with 4 bits. It operates in a temperature range of -55 to 125 °C, suitable for military-grade applications. The package style is in-line with 16 terminals and power supplies of 5/15V, making it ideal for various electronic systems.

Median Price

$25.929

Lifecycle Status

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Freelance Electronics

USA . 38 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corohmni

South Africa . 271 parts In-Stock

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Overview

Elevate your digital shift register game with the MC14015BCL by Onsemi. Crafted with precision and quality, this innovative product offers dual functions, 4 bits, and a MILITARY temperature grade for unparalleled performance. Ideal for various applications, this rectangular package in-line device provides customers with reliable power supplies, durable ceramic construction, and a user-friendly terminal design. Experience the value and benefits of the MC14015BCL and take your projects to the next level with ease. Choose Onsemi for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal stability and mechanical strength, making the shift register durable and reliable for long-term use.

No. of Functions: 2

Having two functions in one device helps in saving space on the circuit board and simplifies the design, reducing overall system complexity.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the circuit board, maximizing use of available space and improving overall layout.

No. of Bits: 4

4 bits provide versatility and flexibility in data processing and storage, suitable for a wide range of digital applications.

Power Supplies (V): 5/15

Support for multiple power supply voltages allows for compatibility with different systems and environments, enhancing usability and integration.

No. of Terminals: 16

Having 16 terminals enables easy connectivity with other components and peripherals, facilitating smooth communication within the system.

Package Style (Meter): IN-LINE

In-line package style offers a compact and streamlined form factor, ideal for applications where space-saving and efficient wiring are essential.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme conditions, making the shift register suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the shift register to function reliably in cold environments without compromising performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish offers good solderability and conductivity, ensuring secure connections and stable operation of the shift register.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options and simplifies installation, enhancing ease of use and versatility.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and robustness, making the shift register suitable for demanding applications and mission-critical systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the shift register efficient and reliable in digital signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides mechanical stability and secure connections, ensuring durability and longevity of the shift register in various operating conditions.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy integration into existing circuit layouts and facilitates compatibility with common components and connectors.

Technical Specifications

Digital Shift Registers MC14015BCL attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC14015BCL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-064-2694, 5962010642694, 5962-99-627-9680, 5962996279680

NIIN

010642694, 996279680

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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