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MC10SX1130DR2G

Onsemi

MC10SX1130DR2G by Onsemi

MC10SX1130DR2G by Onsemi is a 16-terminal LED display driver with serial data input mode. Operating at -40 to 85 °C, it has a supply voltage of 5V and negative supply voltage of -5.2V. Ideal for industrial applications requiring small outline surface-mount packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,881 parts In-Stock

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Digiode

USA . 2,211 parts In-Stock

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AZTECH Wire

Italy . 638 parts In-Stock

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$17.990

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QUARKTWIN TECHNOLOGY LTD

USA . 10,506 parts In-Stock

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Kulean Microsystems

USA . 6,022 parts In-Stock

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Metaverse IC Inc.

Canada . 5,862 parts In-Stock

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Problanco Electronics

Mexico . 2,822 parts In-Stock

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Corphita

USA . 2,316 parts In-Stock

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SupplyDigital Components

Austria . 1,632 parts In-Stock

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TANS Electronics

Latvia . 1,518 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Corohmni

South Africa . 348 parts In-Stock

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UHIMA Technologies

Türkiye . 95 parts In-Stock

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Overview

Enhance your visual displays with the MC10SX1130DR2G by Onsemi, a top-quality Graphics Display Driver that embodies excellence in design and performance. Onsemi's reputation for innovation and reliability shines through in this product, offering seamless serial data input mode and compact small outline packaging for easy integration. Ideal for LED display drivers, this Industrial-grade technology ensures optimal functionality with a nominal supply voltage of 5V, providing customers with unparalleled value and efficiency in their applications. Elevate your graphics with Onsemi's MC10SX1130DR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it suitable for a wide range of applications.

Data Input Mode: SERIAL

Serial data input mode allows for easy and efficient communication with other devices, enhancing overall system performance.

Surface Mount: YES

Surface mount capability enables easy installation and integration into circuit boards, saving time and effort during production.

Power Supplies (V): 5/-5.2

Support for multiple power supply voltages allows flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environments or extended operation periods.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the display driver can function in cold conditions without issues.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable operation of the display driver.

Technical Specifications

Graphics Display Drivers MC10SX1130DR2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10SX1130DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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