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MC10SX1130DG

Onsemi

MC10SX1130DG by Onsemi

MC10SX1130DG by Onsemi is a graphics display driver with 16 terminals, operating at -40 to 85 °C. It has a supply voltage of 5V and negative supply voltage of -5.2V, suitable for LED display driver applications. The small outline package measures 9.9mm x 3.9mm with gull wing terminals for surface mounting in industrial temperature grade environments.

Median Price

$7.580

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 44 parts In-Stock

1+ parts

$6.887

100+ parts

$1.677

1k+ parts

-

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44

$6.887

$1.677

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Chip1Stop

Japan . 44 parts In-Stock

1+ parts

$7.580

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44

$7.580

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Rochester

USA . 27,478 parts In-Stock

1+ parts

-

100+ parts

$7.170

1k+ parts

$6.420

10k+ parts

$6.040

27,478

-

$7.170

$6.420

$6.040

DigiKey

USA . 27,478 parts In-Stock

1+ parts

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$8.300

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27,478

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$8.300

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Verical

USA . 8,111 parts In-Stock

1+ parts

-

100+ parts

$8.963

1k+ parts

$8.025

10k+ parts

-

8,111

-

$8.963

$8.025

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,849 parts In-Stock

1+ parts

$6.543

100+ parts

-

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1,849

$6.543

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Vyrian

USA . 118 parts In-Stock

1+ parts

$6.887

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118

$6.887

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Semi Source

USA . 382 parts In-Stock

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382

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Distributors (Availability)

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Corphita

USA . 2,107 parts In-Stock

1+ parts

$6.198

100+ parts

-

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2,107

$6.198

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Corohmni

South Africa . 88 parts In-Stock

1+ parts

$6.800

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88

$6.800

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Continental Prestige Electronics

USA . 27,478 parts In-Stock

1+ parts

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27,478

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SupplyDigital Components

Austria . 2,739 parts In-Stock

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2,739

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Problanco Electronics

Mexico . 2,253 parts In-Stock

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2,253

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TANS Electronics

Latvia . 1,210 parts In-Stock

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1,210

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Kulean Microsystems

USA . 859 parts In-Stock

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859

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UHIMA Technologies

Türkiye . 675 parts In-Stock

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675

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Microchip USA

USA . 239 parts In-Stock

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239

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Overview

Enhance your graphics display performance with the MC10SX1130DG by Onsemi! This top-quality LED display driver offers reliable power supplies, a sleek small outline package design, and industrial-grade temperature tolerance. Perfect for various applications, this product from Onsemi guarantees optimal functionality, efficiency, and durability. Upgrade your displays today with the MC10SX1130DG and experience superior quality and performance like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and precise communication with other components in the system.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the circuit board.

Power Supplies (V): 5/-5.2

The specified power supplies ensure stable and consistent performance of the display driver.

No. of Terminals: 16

Having 16 terminals enables versatile connectivity options for different display configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances portability and flexibility in design layout.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the display driver can withstand harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer additional flexibility in circuit board layout and connection options.

Nominal Supply Voltage: 5 V

The specified nominal supply voltage ensures compatibility with standard power sources.

Nominal Negative Supply Voltage: -5.2 V

Having a negative supply voltage helps in achieving desired display characteristics and performance.

Technical Specifications

Graphics Display Drivers MC10SX1130DG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10SX1130DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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