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MAX810SQ293D1T1G

Onsemi

MAX810SQ293D1T1G by Onsemi

MAX810SQ293D1T1G by Onsemi is a power management IC with a nominal voltage of 3.3V. It has a small outline, very thin profile package style and can operate in temperatures ranging from -40 to 105 °C. This IC is commonly used as a power supply support circuit in industrial applications.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

$0.247

1k+ parts

$0.205

10k+ parts

$0.183

84,000

-

$0.247

$0.205

$0.183

Verical

USA . 84,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.228

84,000

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-

-

$0.228

Distributors (In-Stock)

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Digiode

USA . 678 parts In-Stock

1+ parts

$0.193

100+ parts

-

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678

$0.193

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.222

100+ parts

-

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50

$0.222

-

-

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Vyrian

USA . 7,027 parts In-Stock

1+ parts

-

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7,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 238 parts In-Stock

1+ parts

$0.183

100+ parts

-

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238

$0.183

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Corohmni

South Africa . 331 parts In-Stock

1+ parts

$0.203

100+ parts

-

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331

$0.203

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$0.222

100+ parts

$0.217

1k+ parts

-

10k+ parts

-

50

$0.222

$0.217

-

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Ampacity Inc.

Singapore . 83,663 parts In-Stock

1+ parts

$0.376

100+ parts

-

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83,663

$0.376

-

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Microchip USA

USA . 5,828 parts In-Stock

1+ parts

$1.557

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5,828

$1.557

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AZTECH Wire

Italy . 538 parts In-Stock

1+ parts

$13.740

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538

$13.740

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Problanco Electronics

Mexico . 7,932 parts In-Stock

1+ parts

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7,932

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TANS Electronics

Latvia . 6,177 parts In-Stock

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6,177

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A-Z Elektronik GmbH

Germany . 4,989 parts In-Stock

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4,989

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SupplyDigital Components

Austria . 4,201 parts In-Stock

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4,201

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Kulean Microsystems

USA . 2,766 parts In-Stock

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2,766

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UHIMA Technologies

Türkiye . 934 parts In-Stock

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934

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Perfect Parts

USA . 784 parts In-Stock

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784

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Kepictronics

USA . 98 parts In-Stock

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98

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Overview

Discover the MAX810SQ293D1T1G, a cutting-edge Power Management IC by Onsemi. As a trusted manufacturer in the industry, Onsemi brings unparalleled quality and reliability to their products. This small outline, very thin profile IC offers a range of benefits and advantages. With its nominal supply voltage of 3.3V and low supply current of 0.0025mA, it provides efficient power supply support for various applications. Its compact size and surface mount capability make it suitable for space-constrained designs. Whether you're working on industrial or consumer electronics, the MAX810SQ293D1T1G is the perfect choice for optimal performance and convenience. Trust Onsemi's expertise and elevate your design with this exceptional Power Management IC.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material for the package body provides durability and resistance to external impacts, making this product suitable for various applications.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation, saving time and effort during the assembly process.

No. of Functions:

1 - This power management IC offers a single, integrated function, reducing the need for additional components and simplifying the overall design.

Package Shape:

RECTANGULAR - The rectangular package shape provides compatibility with standard board designs, ensuring seamless integration into electronic devices.

Nominal Supply Voltage (Vsup):

3.3 V - With a nominal supply voltage of 3.3 V, this power management IC is compatible with a wide range of devices, offering efficient power management solutions.

Power Supplies (V):

1/5.5 - The power supply range of 1 V to 5.5 V enables flexible operation, supporting a diverse range of power sources and systems.

No. of Terminals:

3 - The inclusion of three terminals simplifies the connection process, reducing complexity in system integration.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - The small outline, very thin profile, and shrink pitch package style provides space-saving advantages, making it suitable for compact applications where size is a constraint.

Maximum Operating Temperature:

105 °C - With a high maximum operating temperature of 105°C, this power management IC can reliably handle demanding conditions and ensure stable performance in various environments.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature of -40°C allows this power management IC to operate effectively in cold or extreme temperature environments.

Terminal Finish:

MATTE TIN - The matte tin terminal finish offers excellent solderability and resistance to corrosion, ensuring a reliable connection and prolonged product lifespan.

Terminal Position:

DUAL - The dual terminal position allows for versatile mounting options and flexibility in system layout, enabling efficient integration into different device designs.

Maximum Seated Height:

1 mm - With a maximum seated height of 1 mm, this power management IC is suitable for applications with space restrictions or low-profile designs.

Width (mm):

1.24 mm - The compact width of 1.24 mm allows for easy placement and integration into miniaturized electronic devices.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This product serves as a power supply support circuit, providing voltage regulation and control, enhancing overall system reliability and stability.

Minimum Supply Voltage (Vsup):

1.2 V - The minimum supply voltage requirement of 1.2 V allows compatibility with low power sources and efficient power management in battery-powered devices.

Maximum Time At Peak Reflow Temperature (s):

30 - The ability to withstand a peak reflow temperature for up to 30 seconds enables robust soldering during the assembly process, ensuring reliable connections and preventing solder joint issues.

Peak Reflow Temperature °C:

260 - With a peak reflow temperature of 260°C, this power management IC can endure high-temperature soldering processes, ensuring proper bonding in manufacturing.

Length:

2.1 mm - The compact length of 2.1 mm contributes to the overall small form factor and allows for space optimization in device designs.

Nominal Threshold Voltage (V):

+2.93V - The nominal threshold voltage of +2.93V provides precise voltage detection, contributing to accurate power management and system protection.

Temperature Grade:

INDUSTRIAL - This power management IC is designed to operate reliably in industrial temperature ranges, ensuring stable performance in harsh working conditions.

Maximum Supply Current (Isup):

0.0025 mA - With a maximum supply current of 0.0025 mA, this power management IC offers energy-efficient operation, reducing power consumption and extending battery life in portable devices.

No. of Channels:

1 - The inclusion of a single channel simplifies the overall circuit design, making it suitable for applications where only one power channel is needed.

Technology:

CMOS - Based on CMOS technology, this power management IC offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form:

GULL WING - The gull-wing terminal form facilitates easy and secure soldering, ensuring reliable electrical connections during the manufacturing process.

Terminal Pitch:

0.65 mm - The terminal pitch of 0.65 mm provides compatibility with standard PCB layouts and enables seamless integration into electronic systems.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, this power management IC is suitable for various manufacturing environments, ensuring long-term reliability and preventing moisture-related issues.

Maximum Supply Voltage (Vsup):

5.5 V - The wide maximum supply voltage range of 5.5 V allows compatibility with a diverse range of power sources, providing versatile power management solutions.

Technical Specifications

Power Management ICs MAX810SQ293D1T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOT-323

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.24 mm

Trade Compliance

MAX810SQ293D1T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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