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MAX809SQ400T1G

Onsemi

MAX809SQ400T1G by Onsemi

MAX809SQ400T1G by Onsemi is a Power Management IC with 3.3V Nominal Voltage, -40 to 105 °C Operating Temperature Range, and 0.0025 mA Max Supply Current. It is used in industrial applications for power supply support circuits due to its small outline package style and CMOS technology.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$17.400

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$17.400

-

-

-

Rochester

USA . 1,399,880 parts In-Stock

1+ parts

-

100+ parts

$0.247

1k+ parts

$0.205

10k+ parts

$0.183

1,399,880

-

$0.247

$0.205

$0.183

Verical

USA . 1,263,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.228

1,263,738

-

-

-

$0.228

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 885 parts In-Stock

1+ parts

$0.193

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$0.193

-

-

-

Vyrian

USA . 6,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,113

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 882,413 parts In-Stock

1+ parts

$0.173

100+ parts

-

1k+ parts

-

10k+ parts

-

882,413

$0.173

-

-

-

Corphita

USA . 313 parts In-Stock

1+ parts

$0.183

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$0.183

-

-

-

Corohmni

South Africa . 225 parts In-Stock

1+ parts

$0.203

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$0.203

-

-

-

Component Stockers USA

USA . 1,815,430 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

1,815,430

$0.210

$0.200

$0.180

$0.180

Vigor

Singapore . 3,045 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

3,045

$0.680

-

-

-

Microchip USA

USA . 4,287 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

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10k+ parts

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4,287

$1.557

-

-

-

AZTECH Wire

Italy . 1,101 parts In-Stock

1+ parts

$12.680

100+ parts

-

1k+ parts

-

10k+ parts

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1,101

$12.680

-

-

-

Problanco Electronics

Mexico . 7,222 parts In-Stock

1+ parts

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7,222

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SupplyDigital Components

Austria . 6,844 parts In-Stock

1+ parts

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6,844

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Kulean Microsystems

USA . 5,419 parts In-Stock

1+ parts

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5,419

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A-Z Elektronik GmbH

Germany . 4,556 parts In-Stock

1+ parts

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4,556

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TANS Electronics

Latvia . 4,190 parts In-Stock

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4,190

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Perfect Parts

USA . 2,008 parts In-Stock

1+ parts

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2,008

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UHIMA Technologies

Türkiye . 254 parts In-Stock

1+ parts

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100+ parts

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254

-

-

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

-

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Authorized Procurement Solutions

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10

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Overview

Enhance your power management solutions with the MAX809SQ400T1G by Onsemi. Crafted with precision and quality, this Power Management IC offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this product ensures seamless performance in industrial settings. With a compact design and advanced technology, the MAX809SQ400T1G guarantees optimal power supply support, making it a valuable asset for customers seeking top-notch performance and peace of mind. Choose Onsemi for superior quality and innovation in power management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the Power Management IC, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic devices, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 105 °C

The high operating temperature range allows the Power Management IC to function efficiently even in harsh environments or under heavy loads.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this Power Management IC energy efficient and reliable.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures reliable soldering during the manufacturing process, leading to better product quality.

Technical Specifications

Power Management ICs MAX809SQ400T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOT-323

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.0V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.24 mm

Trade Compliance

MAX809SQ400T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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