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MAX809MTRG

Onsemi

MAX809MTRG by Onsemi

MAX809MTRG by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, matte tin terminal finish, and operates b/w -40 to 105°C. With a max supply voltage of 5.5V and low supply current of 0.0025mA, it provides reliable power supply support in compact designs.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Arrow

USA . 1 parts In-Stock

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$0.110

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Rochester

USA . 16,900 parts In-Stock

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$0.210

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$0.200

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$0.210

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Adafruit Industries

USA . 500 parts In-Stock

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$21.809

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$19.846

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$17.883

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500

$21.809

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$17.883

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Chip1Stop

Japan . 1 parts In-Stock

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Digiode

USA . 781 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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Flip Electronics

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Chip Stock

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Vyrian

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ComSIT USA

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Inventory MP

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Component Sense

UK . 2,931 parts In-Stock

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Bristol Electronics

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ComSIT Distribution GmbH

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Rebound Electronics

UK . 1,624 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 1,208 parts In-Stock

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Lantek

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Semicontronic

India . 4,110 parts In-Stock

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$0.178

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$0.174

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$0.173

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$0.178

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Ampacity Inc.

Singapore . 3,923 parts In-Stock

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$0.178

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Corphita

USA . 1,324 parts In-Stock

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$0.189

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Corohmni

South Africa . 424 parts In-Stock

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$0.202

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Argo Parts USA

USA . 2,959 parts In-Stock

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$0.208

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$0.201

2,959

$0.208

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$0.201

Continental Prestige Electronics

USA . 2,509 parts In-Stock

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$0.327

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$0.165

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$0.128

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Vigor

Singapore . 55 parts In-Stock

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$0.450

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AZTECH Wire

Italy . 352 parts In-Stock

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$9.420

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Aztec Data Supply Inc.

USA . 549 parts In-Stock

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$20.702

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$21.809

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$19.846

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$17.883

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$21.809

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Perfect Parts

USA . 282,430 parts In-Stock

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RC Electronics

USA . 52,518 parts In-Stock

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Lixinc

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Microchip USA

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Benley Electronics

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Problanco Electronics

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TANS Electronics

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S.R.D Solutions

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Netroflash

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kulean Microsystems

USA . 942 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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Allen Electronics Distributors

USA . 125 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the MAX809MTRG by Onsemi, a top-quality Power Management IC that offers unrivaled reliability and efficiency. Manufactured by industry leader Onsemi, this small outline, thin profile IC is designed for industrial-grade applications with a nominal supply voltage of 3.3V. Perfect for power supply support circuits, this versatile component ensures stable performance in a wide range of operating temperatures. Upgrade your system with the MAX809MTRG and experience the superior quality and value that Onsemi delivers to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and helps protect the internal components of the IC, making it a reliable choice for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of devices and systems, making this IC versatile and easy to integrate.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this IC can withstand extreme conditions and maintain reliable performance in demanding environments.

Technology: CMOS

Utilizing CMOS technology helps to achieve low power consumption and efficient operation, making this IC suitable for power management applications where energy efficiency is essential.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power input options, enabling the IC to be used in a wide range of power management scenarios.

Technical Specifications

Power Management ICs MAX809MTRG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.38V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

MAX809MTRG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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