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MAX809HTR

Onsemi

MAX809HTR by Onsemi

MAX809HTR by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, dual terminal position, and CMOS technology. With a wide operating temperature range (-40 to 105 °C), it provides power supply support in compact form factor for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,612 parts In-Stock

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Digiode

USA . 135 parts In-Stock

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AZTECH Wire

Italy . 253 parts In-Stock

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$14.340

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TANS Electronics

Latvia . 7,403 parts In-Stock

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SupplyDigital Components

Austria . 3,819 parts In-Stock

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Corphita

USA . 1,987 parts In-Stock

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Kulean Microsystems

USA . 1,733 parts In-Stock

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UHIMA Technologies

Türkiye . 720 parts In-Stock

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Problanco Electronics

Mexico . 454 parts In-Stock

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Microchip USA

USA . 121 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Overview

Enhance your power management solutions with the MAX809HTR by Onsemi. Known for their top-notch quality and innovative technology, Onsemi delivers reliable Power Management ICs that cater to a wide range of applications. With its compact design and industrial-grade temperature range, the MAX809HTR offers customers unparalleled value and performance. Experience the benefits of efficient power supply support circuitry without compromising on quality or reliability. Upgrade to Onsemi and elevate your power management experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications that require a 3.3V power supply, making it versatile.

Maximum Operating Temperature: 105 °C

Can operate efficiently even in high temperature environments, increasing reliability.

Technology: CMOS

CMOS technology allows for low power consumption, making it energy efficient.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs.

Technical Specifications

Power Management ICs MAX809HTR attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Width (mm):

1.3 mm

Trade Compliance

MAX809HTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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