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M74LCX16245DTR2G

Onsemi

M74LCX16245DTR2G by Onsemi

M74LCX16245DTR2G by Onsemi is a 48-terminal bus driver with 4.5 ns propagation delay and 3-STATE output characteristics. It operates at a voltage range of 2V to 3.6V, making it suitable for bidirectional control applications in industrial settings with a temperature range of -40°C to 85°C.

Median Price

$0.876

Lifecycle Status

Suppliers In-Stock

17

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1k+

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Arrow

USA . 490 parts In-Stock

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$0.742

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Rochester

USA . 7,447 parts In-Stock

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$0.927

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$0.872

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$0.788

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Chip1Stop

Japan . 5,000 parts In-Stock

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$0.826

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Verical

USA . 490 parts In-Stock

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$1.232

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$0.786

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490

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$0.786

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Distributors (In-Stock)

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Digiode

USA . 954 parts In-Stock

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$0.705

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954

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Nova Conductors

Japan . 500 parts In-Stock

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Flip Electronics

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Vyrian

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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4 Star Electronics, Inc.

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Prism Electronics

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Sea View Technologies

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,147 parts In-Stock

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$0.630

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$0.630

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Corphita

USA . 168 parts In-Stock

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$0.668

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Continental Prestige Electronics

USA . 1,785 parts In-Stock

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$0.677

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$0.442

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$0.308

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1,785

$0.677

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$0.308

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Corohmni

South Africa . 262 parts In-Stock

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$0.742

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Argo Parts USA

USA . 4,196 parts In-Stock

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$0.937

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Bastille Electronics

Australia . 40 parts In-Stock

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$0.979

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$0.930

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$0.884

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$0.871

40

$0.979

$0.930

$0.884

$0.871

Aztec Data Supply Inc.

USA . 3,160 parts In-Stock

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$11.540

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AZTECH Wire

Italy . 746 parts In-Stock

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$21.890

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$36.917

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$33.594

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$30.272

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QUARKTWIN TECHNOLOGY LTD

USA . 29,767 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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Metaverse IC Inc.

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TANS Electronics

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 2,464 parts In-Stock

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Assy Fe

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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Overview

Enhance your electronic designs with the M74LCX16245DTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in their products. This bus driver and transceiver offers seamless integration and efficient communication within electronic systems. With a nominal supply voltage of 2.5V and a propagation delay of just 4.5ns, this versatile component is ideal for a wide range of applications. Experience the value of fast data transmission, low power consumption, and compact design with the M74LCX16245DTR2G. Upgrade your projects today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceivers, ensuring a longer product lifespan.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay allows for fast signal processing, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount technology saves space on circuit boards and simplifies the manufacturing process, making it convenient for integration in compact devices.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low supply voltage, reducing power consumption and making it energy-efficient.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Technical Specifications

Bus Driver & Transceivers M74LCX16245DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

M74LCX16245DTR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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