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M74LCX16373DTR2G

Onsemi

M74LCX16373DTR2G by Onsemi

M74LCX16373DTR2G by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage of 2.5V to 3.6V. It features a propagation delay of 5.4ns and can handle load capacitance up to 50pF. This CMOS technology device is ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$1.165

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Chip1Stop

Japan . 958 parts In-Stock

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$1.110

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Mouser Electronics

USA . 1,730 parts In-Stock

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$1.860

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$1.330

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$0.983

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$0.910

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$1.330

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$0.910

Rochester

USA . 2,571 parts In-Stock

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$1.220

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$1.010

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$0.904

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Verical

USA . 966 parts In-Stock

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$0.870

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Vyrian

USA . 424 parts In-Stock

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Digiode

USA . 1,399 parts In-Stock

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Classic Components Corporation

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Cyclops Electronics Ltd

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IBS Electronics

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Bristol Electronics

USA . 3,184 parts In-Stock

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$1.343

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$0.709

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Dan-Mar Components

USA . 3,184 parts In-Stock

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Flip Electronics

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

Germany . 1,805 parts In-Stock

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Sensible Micro Corp

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Speed Components Ltd

Israel . 960 parts In-Stock

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Microfarads

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Corohmni

South Africa . 209 parts In-Stock

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$0.870

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Corphita

USA . 149 parts In-Stock

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RC Electronics

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 7,332 parts In-Stock

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

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Eastek

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Alle Elektronik GmbH

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Speed Components Ltd (Excess)

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TANS Electronics

Latvia . 1,830 parts In-Stock

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UHIMA Technologies

Türkiye . 893 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Overview

Enhance your electronic projects with the M74LCX16373DTR2G by Onsemi, a top-tier manufacturer known for its high-quality components. This bus driver & transceiver offers fast propagation delay and 3-state output characteristics, making it perfect for applications requiring precise data transmission. With a small outline, thin profile package style, and industrial-grade temperature range, this product ensures reliability and performance. Trust Onsemi to deliver cutting-edge solutions that elevate your designs to the next level. Upgrade your projects today with the M74LCX16373DTR2G!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 5.4 ns

The low propagation delay ensures fast signal transmission, making this product efficient for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device simplifies the design and reduces the need for additional components, making this product cost-effective.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage makes this product energy-efficient and suitable for applications where power consumption is a concern.

No. of Bits: 8

The 8-bit design allows for handling a wide range of data, making this product versatile and suitable for various communication protocols.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments, making this product ideal for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-operated devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers M74LCX16373DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

M74LCX16373DTR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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