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LV8860V-MPB-H

Onsemi

LV8860V-MPB-H by Onsemi

LV8860V-MPB-H by Onsemi is a Motion Control IC with 24V supply voltage, 0.7A output current, and BICMOS technology. Ideal for BRUSH DC MOTOR CONTROL applications due to its small outline package style and industrial temperature grade suitability.

Median Price

$1.131

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 184 parts In-Stock

1+ parts

$0.395

100+ parts

$0.395

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$0.395

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184

$0.395

$0.395

$0.395

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Arrow

USA . 17 parts In-Stock

1+ parts

$1.052

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17

$1.052

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Rochester

USA . 3,420 parts In-Stock

1+ parts

$1.210

100+ parts

$1.190

1k+ parts

$1.160

10k+ parts

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3,420

$1.210

$1.190

$1.160

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Chip1Stop

Japan . 17 parts In-Stock

1+ parts

$1.620

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17

$1.620

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Verical

USA . 17 parts In-Stock

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17

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Distributors (In-Stock)

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Digiode

USA . 476 parts In-Stock

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$0.375

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476

$0.375

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Vyrian

USA . 5,706 parts In-Stock

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5,706

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

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160

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Bristol Electronics

USA . 160 parts In-Stock

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160

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Dan-Mar Components

USA . 160 parts In-Stock

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160

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Distributors (Availability)

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Corphita

USA . 736 parts In-Stock

1+ parts

$0.356

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736

$0.356

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Corohmni

South Africa . 337 parts In-Stock

1+ parts

$0.395

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337

$0.395

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,063 parts In-Stock

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7,063

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SupplyDigital Components

Austria . 1,598 parts In-Stock

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1,598

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Kulean Microsystems

USA . 1,279 parts In-Stock

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1,279

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Problanco Electronics

Mexico . 842 parts In-Stock

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842

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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522

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Perfect Parts

USA . 381 parts In-Stock

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381

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Microchip USA

USA . 301 parts In-Stock

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301

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Overview

Elevate your motion control applications with the LV8860V-MPB-H by Onsemi. Crafted with precision and expertise, this Motion Control IC offers unmatched quality and reliability. Whether you're looking to enhance efficiency in robotics, automotive systems, or industrial equipment, this product delivers superior performance and durability. From its compact design to its wide range of compatible power supplies, the LV8860V-MPB-H provides value and benefits that will take your projects to the next level. Trust Onsemi for cutting-edge technology and innovation that empowers your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important.

Nominal Supply Voltage (Vsup): 24 V

The 24V nominal supply voltage ensures compatibility with a wide range of power sources, making the product versatile and easy to integrate into different systems.

No. of Terminals: 16

Having 16 terminals allows for a high degree of connectivity and control, making the product suitable for complex motion control applications that require multiple inputs and outputs.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95 °C, the product can withstand high temperatures, making it reliable in industrial environments where heat is a concern.

Minimum Operating Temperature: -40 °C

The product is designed to operate in extremely cold temperatures as low as -40 °C, ensuring it can perform reliably in a wide range of environments.

Technology: BICMOS

Utilizing BICMOS technology allows for high-speed operation and low power consumption, making the product efficient and suitable for battery-powered applications.

Technical Specifications

Motion Control ICs LV8860V-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 6 TO 34V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3.5 mA

Maximum Supply Voltage (Vsup):

34 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LV8860V-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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