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LV8814J-AH

Onsemi

LV8814J-AH by Onsemi

LV8814J-AH by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 3.6V to 16V, and max output current of 2A. Ideal for industrial applications requiring Brushless DC Motor control in temperatures ranging from -40 °C to 105°C.

Median Price

$7.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,950 parts In-Stock

1+ parts

$7.640

100+ parts

$3.200

1k+ parts

$2.000

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1,950

$7.640

$3.200

$2.000

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Distributors (In-Stock)

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Digiode

USA . 871 parts In-Stock

1+ parts

$7.258

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871

$7.258

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Vyrian

USA . 10,986 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 605 parts In-Stock

1+ parts

$6.876

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605

$6.876

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Corohmni

South Africa . 158 parts In-Stock

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$7.640

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158

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AZTECH Wire

Italy . 513 parts In-Stock

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$18.310

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513

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Perfect Parts

USA . 19,824 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,787 parts In-Stock

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SupplyDigital Components

Austria . 5,842 parts In-Stock

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Microchip USA

USA . 5,204 parts In-Stock

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TANS Electronics

Latvia . 4,724 parts In-Stock

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Problanco Electronics

Mexico . 4,313 parts In-Stock

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Authorized Procurement Solutions

USA . 1,950 parts In-Stock

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GreenTree Electronics

Israel . 1,950 parts In-Stock

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Kulean Microsystems

USA . 1,132 parts In-Stock

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UHIMA Technologies

Türkiye . 794 parts In-Stock

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Overview

Elevate your motion control applications with the LV8814J-AH by Onsemi. Crafted with precision and quality, this Brushless DC Motor Controller offers unparalleled performance and reliability. Ideal for industrial settings, this IC boasts a wide supply voltage range and high output current capacity, ensuring smooth and efficient operation. Say goodbye to limitations and hello to endless possibilities with the LV8814J-AH – the perfect solution for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 12 V

The 12V nominal supply voltage provides a common and standard power requirement for compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this product can withstand high temperature environments, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40 °C makes it suitable for use in cold environments or industrial settings where temperature fluctuations may occur.

Width (mm): 4.4 mm

The compact width of 4.4mm allows for space-saving installation in tight or limited spaces, making it versatile for a variety of applications.

Maximum Output Current: 2 A

The 2A maximum output current capability allows for driving motors or other components that require higher current levels, making it a reliable choice for motion control applications.

Technical Specifications

Motion Control ICs LV8814J-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3.6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

LV8814J-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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