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LV56851UV-XH

Onsemi

LV56851UV-XH by Onsemi

LV56851UV-XH by Onsemi is a Power Management IC with 6 channels and a supply voltage range of 7V to 16V. It operates in industrial temperature grades from -40 °C to 85°C, featuring a rectangular package style with flange mount and zig-zag terminal position. Ideal for power supply support circuits in various applications.

Median Price

$2.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,322 parts In-Stock

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-

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$2.690

1k+ parts

$2.410

10k+ parts

$2.260

1,322

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$2.690

$2.410

$2.260

Distributors (In-Stock)

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Digiode

USA . 2,242 parts In-Stock

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$2.840

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2,242

$2.840

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Vyrian

USA . 7,181 parts In-Stock

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7,181

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Flip Electronics

USA . 720 parts In-Stock

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720

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Distributors (Availability)

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Corphita

USA . 956 parts In-Stock

1+ parts

$2.691

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956

$2.691

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Corohmni

South Africa . 220 parts In-Stock

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$2.990

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220

$2.990

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AZTECH Wire

Italy . 370 parts In-Stock

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$15.520

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370

$15.520

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SupplyDigital Components

Austria . 6,332 parts In-Stock

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Problanco Electronics

Mexico . 2,641 parts In-Stock

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Kulean Microsystems

USA . 2,201 parts In-Stock

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TANS Electronics

Latvia . 966 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Microchip USA

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Overview

Discover the reliability and efficiency of the LV56851UV-XH from Onsemi, a leading manufacturer in the power management ICs category. This versatile product offers unmatched value with its industrial-grade temperature range, 6 channels, and through-hole terminal form. Perfect for power supply support circuits, this IC ensures optimal performance and stability in any application. Trust Onsemi to deliver quality products that exceed expectations and elevate your projects to new heights. Upgrade to the LV56851UV-XH today and experience the difference for yourself!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various types of electronic devices.

Nominal Supply Voltage (Vsup): 14.4 V

The nominal supply voltage of 14.4 V provides a stable power source for the connected components, ensuring proper functionality.

No. of Terminals: 15

Having 15 terminals allows for multiple connections, enabling flexibility in the design and functionality of the power management IC.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting option, ideal for industrial applications where vibration and movement may occur.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this power management IC can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this power management IC suitable for use in a wide range of environmental conditions.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient routing of connections, reducing the chances of signal interference and improving overall performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC includes a power supply support circuit, which enhances the stability and reliability of the power output, making it a reliable choice for various applications.

Minimum Supply Voltage (Vsup): 7 V

The minimum supply voltage of 7 V ensures compatibility with a wide range of power sources, offering versatility in power input options.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this power management IC is designed to withstand harsh environmental conditions typically found in industrial settings.

No. of Channels: 6

Having 6 channels allows for the management and distribution of power to multiple components or subsystems, improving efficiency and performance of the overall system.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy and secure soldering onto a circuit board, ensuring a reliable connection for long-term use.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16 V provides a safety margin for the power management IC, protecting it from potential voltage spikes and ensuring consistent operation.

Technical Specifications

Power Management ICs LV56851UV-XH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XZFM-T15

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

LV56851UV-XH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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