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LC898300XA

Onsemi

LC898300XA by Onsemi

LC898300XA by Onsemi is a Motion Control IC with 9 terminals, operating voltage range of 2.7V to 3.3V, and max output current of 0.15A. It is designed for BRUSH DC MOTOR CONTROL applications, featuring a compact rectangular package suitable for surface mount assembly in commercial extended temperature environments up to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Prism Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 1,134 parts In-Stock

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Digiode

USA . 968 parts In-Stock

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968

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SupplyDigital Components

Austria . 5,720 parts In-Stock

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5,720

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Problanco Electronics

Mexico . 5,497 parts In-Stock

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Kulean Microsystems

USA . 5,042 parts In-Stock

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5,042

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TANS Electronics

Latvia . 4,923 parts In-Stock

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Corphita

USA . 1,033 parts In-Stock

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UHIMA Technologies

Türkiye . 529 parts In-Stock

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529

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Corohmni

South Africa . 278 parts In-Stock

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Overview

Enhance your motion control applications with the LC898300XA by Onsemi. Crafted with precision and expertise, this innovative brush DC motor controller offers unparalleled performance and reliability. With a compact design, advanced CMOS technology, and a wide operating temperature range, this high-quality IC provides seamless integration and optimal functionality. Trust Onsemi's reputation for excellence and elevate your projects to new heights with the LC898300XA. Unlock the potential of your motion control systems and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing costs.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V is common in many applications, providing compatibility with a wide range of systems and components.

Maximum Output Current: 0.15 A

With a maximum output current of 0.15A, this product can provide sufficient power to drive motors and other components effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable in operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in challenging environments with elevated temperatures.

Technical Specifications

Motion Control ICs LC898300XA attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B9

Length:

1.39 mm

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

Maximum Seated Height:

.56 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

1.21 mm

Trade Compliance

LC898300XA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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