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LC898240-WH

Onsemi

LC898240-WH by Onsemi

LC898240-WH by Onsemi is a Motion Control IC with 48 terminals, operating voltage of 3-3.6V, and max output current of 20A. Ideal for industrial applications requiring precise stepper motor control in a compact flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 13,390 parts In-Stock

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Digiode

USA . 556 parts In-Stock

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AZTECH Wire

Italy . 697 parts In-Stock

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$19.260

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TANS Electronics

Latvia . 7,427 parts In-Stock

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Kulean Microsystems

USA . 6,499 parts In-Stock

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SupplyDigital Components

Austria . 2,378 parts In-Stock

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Corphita

USA . 1,175 parts In-Stock

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UHIMA Technologies

Türkiye . 621 parts In-Stock

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Corohmni

South Africa . 395 parts In-Stock

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Microchip USA

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Problanco Electronics

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Overview

Experience unparalleled performance with the LC898240-WH by Onsemi, a leading manufacturer of Motion Control ICs. This cutting-edge product offers exceptional value and benefits, making it ideal for applications requiring precise motion control. With a wide temperature range and high output current capacity, this IC is designed to deliver superior results in industrial settings. Trust Onsemi for top-quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal conductivity and insulation, making the product durable and reliable in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, reducing overall production costs and time.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is common and widely supported, making it compatible with a wide range of applications and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Width (mm): 7 mm

The compact width of 7mm allows for space-saving installation in tight and limited environments, making it suitable for compact devices and systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering during assembly processes, minimizing the risk of defects and ensuring product quality.

Maximum Output Current: 20 A

The high maximum output current of 20A allows the product to drive powerful stepper motors effectively, making it suitable for applications requiring high torque and precision control.

Technical Specifications

Motion Control ICs LC898240-WH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

LC898240-WH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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