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LC898213XC-MH

Onsemi

LC898213XC-MH by Onsemi

LC898213XC-MH by Onsemi is a Motion Control IC with 11 terminals, CMOS technology, and power supplies of 1.8V and 3/3.3V. It comes in a surface-mount plastic/epoxy package and has terminal finish of Tin Silver Copper. Ideal for applications requiring precise motion control in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,732 parts In-Stock

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Digiode

USA . 1,445 parts In-Stock

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1,445

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Distributors (Availability)

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AZTECH Wire

Italy . 707 parts In-Stock

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$19.430

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707

$19.430

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Component Stockers USA

USA . 425 parts In-Stock

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$99.990

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425

$99.990

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Kulean Microsystems

USA . 7,163 parts In-Stock

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7,163

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TANS Electronics

Latvia . 6,607 parts In-Stock

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6,607

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SupplyDigital Components

Austria . 6,605 parts In-Stock

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6,605

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Corphita

USA . 2,300 parts In-Stock

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2,300

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Problanco Electronics

Mexico . 879 parts In-Stock

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879

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Microchip USA

USA . 263 parts In-Stock

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263

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Corohmni

South Africa . 215 parts In-Stock

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215

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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79

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Overview

Unlock the power of precise motion control with the LC898213XC-MH by Onsemi. Crafted with quality and expertise, this Motion Control IC promises seamless operation and unparalleled performance. Whether you're designing robotics, drones, or smart appliances, this product offers unmatched value and reliability. Say goodbye to limitations and hello to endless possibilities with the LC898213XC-MH. Elevate your projects to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and cost-effectiveness, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making this product suitable for space-constrained applications.

Power Supplies (V): 1.8,3/3.3

Support for multiple voltage options provides flexibility in design and compatibility with various systems, enhancing the product's versatility.

No. of Terminals: 11

Having a sufficient number of terminals allows for easy connectivity and integration with other components, simplifying the overall system setup.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections for optimal performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, this product can withstand high-temperature soldering processes without damage, ensuring consistent quality during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering, making this product suitable for demanding manufacturing environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient and reliable operation of this motion control IC.

Technical Specifications

Motion Control ICs LC898213XC-MH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

11

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA11,3X7,11

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC898213XC-MH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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