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LB8503V

Onsemi

LB8503V by Onsemi

LB8503V by Onsemi is a Motion Control IC with 16 terminals, operating voltage range of 7.5-17 V, and max output current of 0.003 A. It is designed for Brush DC Motor control applications, featuring a small outline package with low profile and shrink pitch ideal for compact designs in temperature range -30 to 95 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 447 parts In-Stock

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Digiode

USA . 261 parts In-Stock

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261

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SupplyDigital Components

Austria . 8,056 parts In-Stock

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Kulean Microsystems

USA . 6,667 parts In-Stock

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TANS Electronics

Latvia . 2,949 parts In-Stock

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Problanco Electronics

Mexico . 2,102 parts In-Stock

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Corphita

USA . 1,970 parts In-Stock

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Corohmni

South Africa . 460 parts In-Stock

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UHIMA Technologies

Türkiye . 179 parts In-Stock

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Overview

Experience the power of cutting-edge motion control technology with the LB8503V by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in a wide range of applications. From robotics to automotive systems, this versatile IC is designed to meet the demands of modern industries. With its compact design and advanced features, the LB8503V provides exceptional value and efficiency to our customers. Unlock new possibilities and optimize your systems with the LB8503V - the ultimate choice for motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

The surface mount design makes installation and assembly easier and more efficient.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is commonly used in many applications, making this product compatible with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for more connections and versatility in the system design.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature allows for reliable performance even in harsh environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can function in cold conditions as well.

Maximum Output Current: 0.003 A

The maximum output current of 0.003A is suitable for driving small DC motors efficiently.

Technical Specifications

Motion Control ICs LB8503V attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 5.5 TO 6.5V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.003 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB8503V Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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