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LB8503V-MPB-E

Onsemi

LB8503V-MPB-E by Onsemi

LB8503V-MPB-E by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 7.5-17 V, and output current of 0.003 A. Ideal for BRUSH DC MOTOR CONTROLLER applications due to its small outline package and bipolar technology. Operates b/w -30 to 95 °C temperature range.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

-

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$1.240

1k+ parts

$1.030

10k+ parts

$0.918

19

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$1.240

$1.030

$0.918

Distributors (In-Stock)

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Digiode

USA . 1,393 parts In-Stock

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$0.969

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1,393

$0.969

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Vyrian

USA . 2,380 parts In-Stock

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2,380

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Distributors (Availability)

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Corphita

USA . 958 parts In-Stock

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$0.918

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-

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958

$0.918

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Corohmni

South Africa . 139 parts In-Stock

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$1.020

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139

$1.020

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AZTECH Wire

Italy . 1,027 parts In-Stock

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$15.330

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1,027

$15.330

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TANS Electronics

Latvia . 7,149 parts In-Stock

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7,149

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Kulean Microsystems

USA . 6,621 parts In-Stock

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6,621

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SupplyDigital Components

Austria . 522 parts In-Stock

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522

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UHIMA Technologies

Türkiye . 427 parts In-Stock

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427

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Microchip USA

USA . 401 parts In-Stock

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401

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Perfect Parts

USA . 384 parts In-Stock

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384

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Problanco Electronics

Mexico . 131 parts In-Stock

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131

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Overview

Unleash the power of precision and reliability with the LB8503V-MPB-E by Onsemi. Crafted by a trusted manufacturer in motion control ICs, this product offers unparalleled quality and performance. Ideal for applications requiring precise brush DC motor control, this small outline, low profile IC boasts a wide range of features to enhance efficiency and accuracy. Experience the value of seamless operation and superior functionality with the LB8503V-MPB-E from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the motion control IC, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easier integration onto circuit boards, making installation efficient and saving space in the overall system design.

Nominal Supply Voltage (Vsup): 12 V

Having a nominal supply voltage of 12V ensures compatibility with a wide range of systems and power sources, making it a versatile option for different applications.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature of 95 °C, this motion control IC can withstand heat and perform reliably in demanding environments without risk of overheating.

Technology: BIPOLAR

Utilizing bipolar technology allows for precise control and efficient power management, contributing to the overall performance and effectiveness of the motion control IC.

Technical Specifications

Motion Control ICs LB8503V-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 5.5 TO 6.5V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.003 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6.5 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB8503V-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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