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LA74309TT-TLM-E

Onsemi

LA74309TT-TLM-E by Onsemi

LA74309TT-TLM-E by Onsemi is an audio preamplifier with 3.3V power supply, 10 terminals, and 7mA max supply current. It operates b/w -20 °C to 85°C, in a small outline package suitable for surface mount applications. Ideal for audio and video amplification needs.

Median Price

$0.687

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,383 parts In-Stock

1+ parts

-

100+ parts

$0.687

1k+ parts

$0.570

10k+ parts

$0.508

1,383

-

$0.687

$0.570

$0.508

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,329 parts In-Stock

1+ parts

$0.535

100+ parts

-

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2,329

$0.535

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Vyrian

USA . 7,849 parts In-Stock

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7,849

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DigiKey Marketplace

USA . 1,383 parts In-Stock

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1,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,431 parts In-Stock

1+ parts

$0.507

100+ parts

-

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2,431

$0.507

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-

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Corohmni

South Africa . 232 parts In-Stock

1+ parts

$0.563

100+ parts

-

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232

$0.563

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AZTECH Wire

Italy . 1,124 parts In-Stock

1+ parts

$20.230

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1,124

$20.230

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QUARKTWIN TECHNOLOGY LTD

USA . 15,230 parts In-Stock

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15,230

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SupplyDigital Components

Austria . 7,052 parts In-Stock

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7,052

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Problanco Electronics

Mexico . 5,690 parts In-Stock

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5,690

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Microchip USA

USA . 5,263 parts In-Stock

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5,263

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Kepictronics

USA . 5,095 parts In-Stock

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5,095

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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TANS Electronics

Latvia . 3,161 parts In-Stock

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3,161

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GreenTree Electronics

Israel . 595 parts In-Stock

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595

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UHIMA Technologies

Türkiye . 384 parts In-Stock

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384

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Kulean Microsystems

USA . 138 parts In-Stock

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138

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Overview

Enhance your audio and video experience with the LA74309TT-TLM-E by Onsemi. Crafted with precision and expertise, this audio preamplifier offers unparalleled quality and performance. Ideal for a wide range of applications, this product is designed to elevate your sound system to new heights. With its advanced technology and reliable construction, customers can trust in the value and benefits that Onsemi brings to the table. Upgrade your audio setup today with the LA74309TT-TLM-E and enjoy a superior listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient use of space on the circuit board and easy alignment during assembly.

General IC Type: AUDIO PREAMPLIFIER

Specifically designed for audio preamplification, ensuring high-quality sound output and compatibility with audio systems.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, suitable for a wide range of electronic devices and power sources.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish offers good solderability and reliability for a stable electrical connection.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for continuous performance under varying environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality even in cold environments, making it versatile for different applications.

Technology: BIPOLAR

Bipolar technology provides excellent signal amplification and accuracy, essential for audio preamplification.

Maximum Supply Current: 7 mA

Low maximum supply current helps in energy efficiency and reduces power consumption when in operation.

Technical Specifications

Audio & Video Amplifiers LA74309TT-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

7 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

LA74309TT-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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