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LA4815VH-MPB-H

Onsemi

LA4815VH-MPB-H by Onsemi

LA4815VH-MPB-H by Onsemi is an audio amplifier IC with 12V power supply, 14 terminals, and bipolar technology. It features a small outline package with gull wing terminals for surface mount applications. Ideal for audio and video amplification in temperature range of -30 to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 750 parts In-Stock

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750

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Component Stockers USA

USA . 318 parts In-Stock

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$99.990

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318

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QUARKTWIN TECHNOLOGY LTD

USA . 29,063 parts In-Stock

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Problanco Electronics

Mexico . 7,729 parts In-Stock

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SupplyDigital Components

Austria . 4,433 parts In-Stock

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Kulean Microsystems

USA . 4,235 parts In-Stock

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Microchip USA

USA . 2,468 parts In-Stock

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Corphita

USA . 2,154 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,031 parts In-Stock

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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527

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Corohmni

South Africa . 356 parts In-Stock

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Overview

Upgrade your audio experience with the LA4815VH-MPB-H by Onsemi! This high-quality audio amplifier offers crystal-clear sound in a compact and durable package. Whether you're a music enthusiast, audiophile, or professional, this product is perfect for enhancing your audio setups. With Onsemi's reputation for top-notch manufacturing and reliability, you can trust that the LA4815VH-MPB-H will deliver exceptional performance every time. Say goodbye to mediocre sound quality and hello to an immersive listening experience with this innovative amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, enhancing its portability and overall longevity.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, ideal for applications with limited space availability.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier specifically designed for amplifying audio signals, this product ensures high-quality sound output and enhanced audio performance.

Power Supplies (V): 12

With a power supply of 12 volts, this amplifier can deliver sufficient power to drive audio devices and produce clear and powerful sound output.

No. of Terminals: 14

A higher number of terminals allow for more connection options and flexibility in integrating the amplifier with various audio devices and systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and provides a neat and tidy appearance, making it suitable for compact installations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding environments where heat may be a concern.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows the amplifier to function effectively in cold climates or refrigerated settings.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish offers good conductivity and solderability, ensuring secure and stable connections for optimal audio signal transmission.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and orientation, allowing for versatile integration with different circuit configurations and setups.

Technology: BIPOLAR

Bipolar technology utilized in the amplifier ensures high-fidelity audio reproduction and efficient power handling, resulting in superior sound quality.

Terminal Form: GULL WING

The gull wing terminal form offers increased strength and reliability in the solder joints, enhancing the overall durability and performance of the amplifier.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for high-density mounting and precise connections, contributing to a compact and efficient circuit layout.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the amplifier is suitable for use in environments with moderate exposure to moisture, ensuring long-term reliability and performance.

Technical Specifications

Audio & Video Amplifiers LA4815VH-MPB-H attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14/20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA4815VH-MPB-H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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