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LA4815VH-TLM-H

Onsemi

LA4815VH-TLM-H by Onsemi

LA4815VH-TLM-H by Onsemi is an audio amplifier IC with 20 terminals, operating at temperatures from -30 to 70 °C. It has a power supply of 12V and a max supply current of 9.5mA. This bipolar technology chip is ideal for audio and video amplification applications in small outline packages.

Median Price

$1.225

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 80 parts In-Stock

1+ parts

$1.225

100+ parts

$1.152

1k+ parts

$1.041

10k+ parts

$1.041

80

$1.225

$1.152

$1.041

$1.041

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,089 parts In-Stock

1+ parts

$1.164

100+ parts

-

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1,089

$1.164

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Vyrian

USA . 5,551 parts In-Stock

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5,551

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 281 parts In-Stock

1+ parts

$1.102

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-

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281

$1.102

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Corohmni

South Africa . 287 parts In-Stock

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$1.225

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287

$1.225

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$15.260

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397

$15.260

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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TANS Electronics

Latvia . 7,830 parts In-Stock

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7,830

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QUARKTWIN TECHNOLOGY LTD

USA . 6,067 parts In-Stock

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6,067

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Problanco Electronics

Mexico . 5,550 parts In-Stock

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5,550

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SupplyDigital Components

Austria . 2,973 parts In-Stock

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2,973

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Kulean Microsystems

USA . 1,814 parts In-Stock

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1,814

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UHIMA Technologies

Türkiye . 367 parts In-Stock

1+ parts

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367

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Microchip USA

USA . 273 parts In-Stock

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273

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Overview

Enhance your audio and video experience with the LA4815VH-TLM-H by Onsemi. This high-quality audio amplifier is designed for optimal performance and reliability, making it the perfect choice for a wide range of applications. From home entertainment systems to professional audio setups, this versatile device delivers crystal-clear sound and powerful amplification. Trust in Onsemi's reputation for excellence and innovation, and elevate your audio experience to new heights. Unlock the true potential of your audio equipment with the LA4815VH-TLM-H – where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it easy to handle and install.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used for audio amplifiers, providing a compact design that fits well in various electronic devices.

Power Supplies (V): 12

With a power supply of 12V, this amplifier can provide sufficient power for audio output, ensuring high-quality sound performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures that the amplifier can operate efficiently even in a warm environment.

Technology: BIPOLAR

The bipolar technology used in this amplifier allows for better signal amplification, producing clear and crisp audio output.

Technical Specifications

Audio & Video Amplifiers LA4815VH-TLM-H attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

9.5 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA4815VH-TLM-H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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