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LA4815M-TLM-H

Onsemi

LA4815M-TLM-H by Onsemi

LA4815M-TLM-H by Onsemi is an audio amplifier IC with 8 terminals, operating voltage of 6V, and max supply current of 8.3mA. It is a bipolar technology device in a small outline package suitable for audio and video amplification applications. Operating temperature range from -30 °C to 70°C makes it versatile for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,679 parts In-Stock

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2,679

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Digiode

USA . 104 parts In-Stock

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104

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Distributors (Availability)

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AZTECH Wire

Italy . 269 parts In-Stock

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$8.480

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269

$8.480

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TANS Electronics

Latvia . 7,662 parts In-Stock

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Problanco Electronics

Mexico . 6,925 parts In-Stock

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6,925

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Corphita

USA . 2,164 parts In-Stock

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SupplyDigital Components

Austria . 1,702 parts In-Stock

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1,702

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UHIMA Technologies

Türkiye . 826 parts In-Stock

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826

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Kulean Microsystems

USA . 329 parts In-Stock

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329

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Corohmni

South Africa . 132 parts In-Stock

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Microchip USA

USA . 118 parts In-Stock

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Overview

Enhance your audio experience with the LA4815M-TLM-H by Onsemi. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and reliability. Ideal for a variety of applications in the audio and video industry, this product guarantees optimal performance and efficiency. With its advanced technology and innovative design, customers can expect superior sound amplification and crystal-clear output. Elevate your audio projects with the LA4815M-TLM-H and enjoy the ultimate value and benefits it provides. Trust Onsemi to deliver excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, ensuring the product will last a long time.

Surface Mount: YES

Allows for easy installation and integration into various electronic devices.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit this amplifier into compact spaces.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring optimal sound quality.

Power Supplies (V): 6

Operates on a common voltage, making it compatible with a wide range of power sources.

Maximum Operating Temperature: 70 °C

Capable of operating in high-temperature environments without compromising performance.

Technology: BIPOLAR

Utilizes bipolar technology for efficient amplification and low distortion.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate levels of moisture, ensuring reliability in various environmental conditions.

Technical Specifications

Audio & Video Amplifiers LA4815M-TLM-H attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

8.3 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LA4815M-TLM-H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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