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LA4625

Onsemi

LA4625 by Onsemi

LA4625 by Onsemi is a 2-function audio amplifier IC with 12V power supply, operating b/w -20 °C to 85°C. It features a max supply current of 240mA and comes in a rectangular plastic/epoxy package style with 14 terminals. Ideal for audio and video applications requiring bipolar technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,721 parts In-Stock

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Vyrian

USA . 1,015 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Kulean Microsystems

USA . 7,356 parts In-Stock

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SupplyDigital Components

Austria . 4,034 parts In-Stock

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Problanco Electronics

Mexico . 2,754 parts In-Stock

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TANS Electronics

Latvia . 2,422 parts In-Stock

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Corphita

USA . 678 parts In-Stock

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Kepictronics

USA . 271 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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UHIMA Technologies

Türkiye . 100 parts In-Stock

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Overview

Enhance your audio experience with the LA4625 by Onsemi, a top-of-the-line audio amplifier designed to deliver premium sound quality. Manufactured by Onsemi, a trusted name in the industry known for their high-quality products, this amplifier is perfect for various applications in audio and video systems. With its sleek design and advanced technology, the LA4625 offers customers unmatched value, benefits, and advantages. Upgrade your audio setup today and enjoy crystal clear sound like never before with the LA4625 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product portable and long-lasting.

No. of Functions: 2

Having multiple functions allows for versatility and flexibility in use, making the product suitable for a variety of audio amplification needs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation in various audio setups.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification purposes, ensuring high-quality sound output.

Power Supplies (V): 12

Operating at 12V offers a good balance between power efficiency and performance.

No. of Terminals: 14

More terminals provide increased connectivity options and signal routing capabilities.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into existing audio systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for use in a wide range of environments without risk of damage.

Terminal Position: ZIG-ZAG

Zig-zag terminal position facilitates efficient PCB layout and design.

Technology: BIPOLAR

Bipolar technology offers good linearity and low distortion for high-quality audio amplification.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the PCB.

Maximum Supply Current: 240 mA

High maximum supply current ensures ample power delivery for optimal audio performance.

Terminal Pitch: 1.78 mm

Narrow terminal pitch allows for compact design and space-saving installation.

Technical Specifications

Audio & Video Amplifiers LA4625 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T14

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP14,.06,.09,70

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

240 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA4625 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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