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LA4631

Onsemi

LA4631 by Onsemi

LA4631 by Onsemi is an audio amplifier IC with 2 functions, operating at temperatures from -20 °C to 70°C. It has a max supply current of 80mA and operates on a power supply of 14V. This IC is commonly used in audio and video amplifiers due to its commercial temperature grade and plastic/epoxy package material.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,342 parts In-Stock

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Digiode

USA . 1,190 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 43 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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Kulean Microsystems

USA . 3,916 parts In-Stock

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Problanco Electronics

Mexico . 2,748 parts In-Stock

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SupplyDigital Components

Austria . 2,122 parts In-Stock

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TANS Electronics

Latvia . 1,578 parts In-Stock

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Corphita

USA . 1,386 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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Overview

Elevate your audio experience with the LA4631 by Onsemi, a top-of-the-line audio amplifier that delivers unparalleled sound quality and performance. Manufactured by Onsemi, a trusted name in the industry known for their superior products, this amplifier is perfect for a wide range of applications in the Audio & Video category. With 2 functions packed into one sleek package, the LA4631 offers customers exceptional value, benefits, and advantages. Upgrade your audio system today with the LA4631 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the amplifier lightweight and durable, allowing for easy handling and long-lasting performance.

No. of Functions: 2

Having 2 functions in a single amplifier provides versatility and flexibility in audio amplification, allowing it to be used for a variety of applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound reproduction and clarity, making it a suitable choice for audio enthusiasts and professionals.

Power Supplies (V): 14

With a power supply of 14V, this amplifier can deliver sufficient power to drive speakers and headphones, ensuring robust and clear audio output.

No. of Terminals: 13

Having 13 terminals allows for easy connections with other audio equipment, making installation and setup hassle-free.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures stable performance even under demanding conditions, making it suitable for various environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C allows the amplifier to function effectively in cold environments without overheating or malfunctioning.

Temperature Grade: COMMERCIAL

Being rated for commercial use ensures that this amplifier meets industry standards for reliability and performance, making it a dependable choice for professional applications.

Maximum Supply Current: 80 mA

With a maximum supply current of 80 mA, this amplifier consumes low power while delivering high-quality audio output, making it energy-efficient and cost-effective.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection of wires, ensuring a secure and reliable electrical connection within the amplifier.

Technical Specifications

Audio & Video Amplifiers LA4631 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

13

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP13,.05,79

Power Supplies (V):

14

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

80 mA

Surface Mount:

NO

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

LA4631 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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