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LA4625-P-E

Onsemi

LA4625-P-E by Onsemi

LA4625-P-E by Onsemi is a 2-function audio amplifier IC with 12V power supply, operating b/w -20 °C to 85°C. It features 14 terminals in a rectangular package style suitable for audio and video amplification applications. With a max supply current of 240mA, it offers reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 52,000 parts In-Stock

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Vyrian

USA . 13,024 parts In-Stock

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Digiode

USA . 192 parts In-Stock

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192

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AZTECH Wire

Italy . 847 parts In-Stock

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$19.820

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847

$19.820

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Component Stockers USA

USA . 558 parts In-Stock

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$99.990

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558

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Kulean Microsystems

USA . 5,963 parts In-Stock

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Problanco Electronics

Mexico . 4,630 parts In-Stock

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TANS Electronics

Latvia . 4,626 parts In-Stock

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Microchip USA

USA . 4,027 parts In-Stock

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SupplyDigital Components

Austria . 762 parts In-Stock

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Corphita

USA . 752 parts In-Stock

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Corohmni

South Africa . 160 parts In-Stock

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Overview

Enhance your audio experience with the LA4625-P-E by Onsemi. Manufactured by a renowned industry leader, this audio amplifier offers unparalleled quality and reliability. Ideal for various applications in the audio and video industry, this product provides exceptional value with its innovative design and superior performance. Elevate your sound system to new heights with the LA4625-P-E, delivering clear and powerful audio output that will impress even the most discerning customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio applications.

No. of Functions: 2

Having multiple functions in a single amplifier adds versatility to the product, allowing for various audio configurations.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into different designs and layouts.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier specifically designed for audio applications ensures high-quality sound output.

Power Supplies (V): 12

Operating at 12V provides sufficient power for audio amplification without consuming too much energy.

No. of Terminals: 14

Having 14 terminals allows for multiple connection options and enhances the flexibility of the amplifier.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for easier cable management in setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -20 °C

With a low minimum operating temperature, the amplifier can function in various environments without any issues.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish offers good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: ZIG-ZAG

The zig-zag terminal position helps in efficient PCB layout and connectivity, simplifying the assembly process.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical support and ease of soldering during installation.

Maximum Supply Current: 240 mA

The maximum supply current of 240mA ensures stable operation and prevents overloading of the amplifier.

Terminal Pitch: 1.78 mm

The 1.78mm terminal pitch allows for easy connection of components and helps in achieving a compact design.

Technical Specifications

Audio & Video Amplifiers LA4625-P-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T14

JESD-609 Code:

e6

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP14,.06,.09,70

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

240 mA

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA4625-P-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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