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HCPL2731V

Onsemi

HCPL2731V by Onsemi

HCPL2731V by Onsemi is a 2-channel optocoupler with separate configuration. It offers a min CTR of 400%, max forward current of 0.02A, and isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -40 to 85°C with through-hole mounting.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$1.640

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Flip Electronics

USA . 3,000 parts In-Stock

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DigiKey Marketplace

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Vyrian

USA . 2,557 parts In-Stock

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Digiode

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A2Z Electronics, Inc.

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Semicontronic

India . 2,535 parts In-Stock

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$0.100

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$0.098

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$0.097

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Aztec Data Supply Inc.

USA . 2,606 parts In-Stock

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$0.657

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Continental Prestige Electronics

USA . 4,054 parts In-Stock

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$1.585

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Argo Parts USA

USA . 2,292 parts In-Stock

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Corohmni

South Africa . 402 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.558

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$1.525

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$1.685

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$1.601

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Ampacity Inc.

Singapore . 2,837 parts In-Stock

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Problanco Electronics

Mexico . 4,858 parts In-Stock

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Supply Digital

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Kulean Microsystems

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TANS Electronics

Latvia . 2,370 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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Corphita

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SupplyDigital Components

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UHIMA Technologies

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Overview

Looking for a high-quality optocoupler circuit output? Look no further than the HCPL2731V by Onsemi! With its separate 2-channel configuration and impressive features, this logic IC output optocoupler offers customers unmatched value and benefits. Whether you're looking to improve signal isolation in industrial automation or enhance noise immunity in power supply applications, the HCPL2731V delivers reliable performance and peace of mind. Trust Onsemi's reputation for excellence and choose the HCPL2731V for your next project.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent control and isolation of two different signals, providing flexibility in usage.

Maximum Forward Current: 0.02 A

The high maximum forward current capability ensures compatibility with a wide range of circuits and devices, making it versatile.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler, it is specifically designed for interfacing with logic circuits, enabling smooth communication between different components.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this optocoupler can function reliably in extreme cold conditions, making it suitable for various environments.

Maximum Power Dissipation: 0.1 W

The high maximum power dissipation capability indicates that this product can handle power efficiently without overheating, ensuring durability.

Minimum Current Transfer Ratio: 400 %

The high minimum current transfer ratio indicates efficient signal transmission, resulting in accurate and reliable data transfer between connected systems.

Maximum Isolation Voltage: 2500 V

With a high maximum isolation voltage, this optocoupler provides excellent electrical isolation between input and output, ensuring safety and preventing signal interference.

Maximum Forward Voltage: 1.7 V

The low maximum forward voltage drop minimizes power loss and heat generation, enhancing energy efficiency and performance.

Maximum On State Current: 0.06 A

The high maximum on-state current rating allows for reliable operation even under heavy loads, ensuring stable performance in demanding applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL2731V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Minimum Current Transfer Ratio:

400 %

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

1.7 V

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Power Dissipation:

.1 W

Shape:

RECTANGULAR

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

HCPL2731V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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