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HCPL2731VM

Onsemi

HCPL2731VM by Onsemi

HCPL2731VM by Onsemi is a 2-channel logic IC output optocoupler with max isolation voltage of 5000V. It has separate configuration, through-hole mount, and operates b/w -40 to 100 °C. Ideal for applications requiring high isolation and logic signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,825 parts In-Stock

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1,825

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Vyrian

USA . 139 parts In-Stock

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139

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Distributors (Availability)

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Native Components

USA . 726 parts In-Stock

1+ parts

$317.420

100+ parts

$311.072

1k+ parts

$307.897

10k+ parts

$304.723

726

$317.420

$311.072

$307.897

$304.723

Northwest PG Solutions

USA . 5 parts In-Stock

1+ parts

$349.162

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5

$349.162

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TANS Electronics

Latvia . 7,958 parts In-Stock

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7,958

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Problanco Electronics

Mexico . 3,148 parts In-Stock

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3,148

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SupplyDigital Components

Austria . 2,727 parts In-Stock

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2,727

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Corphita

USA . 2,114 parts In-Stock

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2,114

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Kulean Microsystems

USA . 447 parts In-Stock

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447

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UHIMA Technologies

Türkiye . 402 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Overview

Experience superior quality and reliability with the HCPL2731VM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge optocoupler circuit outputs that are perfect for various applications. With its separate 2-channel configuration and maximum isolation voltage of 5000V, this product ensures optimal performance and safety. Whether you're in need of logic IC output optocouplers for industrial automation or power supply designs, the HCPL2731VM offers unmatched value, benefits, and advantages to meet your needs. Trust Onsemi to provide you with the best solutions for your projects.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent control and operation of each function, providing flexibility and customization in usage.

Maximum Forward Current: 0.02 A

The high maximum forward current capacity ensures reliable performance and the ability to handle a range of applications without overheating or malfunctioning.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler indicates compatibility with digital logic circuits and the ability to provide isolation between input and output signals.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this product can withstand high temperatures and operate reliably in various environments.

Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and ensures a compact and space-efficient layout.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables this product to be used in cold conditions without compromising performance.

No. of Elements: 2

Having two elements provides redundancy and backup functionality, ensuring continued operation even if one element fails.

Packing Method: TUBE

The tube packaging method facilitates easy storage, handling, and transportation of the product, ensuring convenience for users.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage of 5000 volts ensures safe isolation of input and output signals, protecting equipment from damage and ensuring user safety.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable installation of the product onto circuit boards, ensuring reliable performance and durability.

Maximum On State Current: 0.06 A

The high maximum on-state current capability of 0.06 amps allows for handling larger currents without risk of overheating or failure, making this product suitable for high-power applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL2731VM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Shape:

RECTANGULAR

Trade Compliance

HCPL2731VM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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