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FXMA9306MUX

Onsemi

FXMA9306MUX by Onsemi

FXMA9306MUX by Onsemi is an 8-terminal interface IC with a supply voltage range of 1V to 5.5V, suitable for industrial applications. It features a small outline package style, gull wing terminals, and operates in temperatures from -40 °C to 85°C. Ideal for various function interface circuits requiring a compact design and high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,496 parts In-Stock

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2,496

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Digiode

USA . 1,445 parts In-Stock

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1,445

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 893 parts In-Stock

1+ parts

$0.650

100+ parts

-

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893

$0.650

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Northwest PG Solutions

USA . 1,243 parts In-Stock

1+ parts

$0.714

100+ parts

-

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1,243

$0.714

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SupplyDigital Components

Austria . 5,538 parts In-Stock

1+ parts

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5,538

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TANS Electronics

Latvia . 4,487 parts In-Stock

1+ parts

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4,487

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Problanco Electronics

Mexico . 1,241 parts In-Stock

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1,241

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Corphita

USA . 1,016 parts In-Stock

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1,016

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Kulean Microsystems

USA . 456 parts In-Stock

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456

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Corohmni

South Africa . 202 parts In-Stock

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202

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UHIMA Technologies

Türkiye . 184 parts In-Stock

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184

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Overview

Unlock endless possibilities with the FXMA9306MUX by Onsemi, a cutting-edge interface circuit that seamlessly integrates into various applications. Crafted with precision and expertise by Onsemi, this high-quality product offers unparalleled value and benefits to customers. With a wide operating temperature range and compact design, the FXMA9306MUX delivers reliable performance and efficiency. Explore new horizons in technology and innovation with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body helps in providing durability and protection to the internal components of the IC.

Surface Mount: YES

The surface mount capability makes it easier to mount the IC on circuit boards, allowing for more efficient and compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this IC can handle a wide range of voltage inputs, making it versatile for various applications.

Package Shape: SQUARE

The square package shape helps in saving space on the circuit board and allows for easier placement and orientation during assembly.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for the IC to interface with other components in a circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can perform reliably in a variety of industrial environments.

Terminal Form: GULL WING

The gull wing terminal form makes it easier to solder the IC onto the circuit board, ensuring a secure and reliable connection.

Technical Specifications

Other Function Interface ICs FXMA9306MUX attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

FXMA9306MUX Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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