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FSUSB30UMX

Onsemi

FSUSB30UMX by Onsemi

FSUSB30UMX by Onsemi is a 10-terminal DPDT chip carrier switch with 3.3V supply, -40 to 85°C temp range, and 0.55mm seated height. Ideal for industrial applications requiring separate outputs, it offers 30dB isolation, 0.35ohm resistance match, and fast switching times of 25ns off and 30ns on.

Median Price

$0.374

Lifecycle Status

EOL

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 150 parts In-Stock

1+ parts

$0.412

100+ parts

$0.242

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$0.242

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Flip Electronics (Authorized)

USA . 40,000 parts In-Stock

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EBV Elektronik

Germany . 10,000 parts In-Stock

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Verical

USA . 8,662 parts In-Stock

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$0.420

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$0.420

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Rochester

USA . 369 parts In-Stock

1+ parts

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$0.336

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$0.279

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$0.249

369

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$0.336

$0.279

$0.249

Chip1Stop

Japan . 140 parts In-Stock

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$0.242

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$0.242

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Distributors (In-Stock)

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Digiode

USA . 707 parts In-Stock

1+ parts

$0.262

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707

$0.262

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Nova Conductors

Japan . 61 parts In-Stock

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$0.315

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$0.315

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Chip Stock

USA . 178,000 parts In-Stock

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Flip Electronics

USA . 25,000 parts In-Stock

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Vyrian

USA . 10,507 parts In-Stock

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Cyclops Electronics Ltd

UK . 9,979 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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Semi Source

USA . 4,769 parts In-Stock

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Sensible Micro Corp

USA . 2,949 parts In-Stock

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Martec Srl

Italy . 1,146 parts In-Stock

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Bristol Electronics

USA . 75 parts In-Stock

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Ampacity Inc.

Singapore . 9,717 parts In-Stock

1+ parts

$0.206

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$0.206

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Corohmni

South Africa . 178 parts In-Stock

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$0.242

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178

$0.242

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Corphita

USA . 915 parts In-Stock

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$0.248

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915

$0.248

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Continental Prestige Electronics

USA . 3,696 parts In-Stock

1+ parts

$0.315

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$0.309

3,696

$0.315

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$0.309

Argo Parts USA

USA . 3,376 parts In-Stock

1+ parts

$0.315

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$0.306

3,376

$0.315

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$0.306

Semicontronic

India . 9,758 parts In-Stock

1+ parts

$0.448

100+ parts

$0.437

1k+ parts

$0.435

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9,758

$0.448

$0.437

$0.435

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Microchip USA

USA . 3,098 parts In-Stock

1+ parts

$1.760

100+ parts

$1.750

1k+ parts

$1.740

10k+ parts

$1.740

3,098

$1.760

$1.750

$1.740

$1.740

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$8.535

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$8.194

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$8.194

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$8.535

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$8.194

$8.194

Aztec Data Supply Inc.

USA . 1,450 parts In-Stock

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$12.829

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Perfect Parts

USA . 31,303 parts In-Stock

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ChipstoGo Electronic ltd

UK . 10,052 parts In-Stock

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Lixinc

USA . 9,072 parts In-Stock

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Problanco Electronics

Mexico . 6,065 parts In-Stock

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GreenTree Electronics

Israel . 4,940 parts In-Stock

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Authorized Procurement Solutions

USA . 4,840 parts In-Stock

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Kulean Microsystems

USA . 4,574 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,918 parts In-Stock

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Supply Digital

USA . 2,121 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,945 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.309

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$0.299

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$0.293

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Assy Fe

Spain . 1,000 parts In-Stock

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TANS Electronics

Latvia . 978 parts In-Stock

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iodParts Technologies Inc.

India . 714 parts In-Stock

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SupplyDigital Components

Austria . 594 parts In-Stock

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Infinite Electronics LLP (Excess)

. 399 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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Overview

Upgrade your electronics with the FSUSB30UMX from Onsemi, a leading manufacturer in the field of multiplexers & switches. This high-quality product offers customers seamless switching capabilities with separate outputs, low on-state resistance, and excellent isolation. With a compact chip carrier design and a wide temperature range, the FSUSB30UMX is perfect for a variety of industrial applications. Trust Onsemi for reliable performance and innovative solutions that add exceptional value to your projects. Elevate your designs with the FSUSB30UMX today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and costs.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used supply voltage, making it compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, enhancing versatility of the product.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliability and longevity.

No. of Channels: 2

Dual-channel design allows for multiple signal inputs, increasing flexibility in switching options.

Technical Specifications

Multiplexers & Switches FSUSB30UMX attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N10

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

30 dB

Nominal On-state Resistance Match:

.35 ohm

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

30 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

FSUSB30UMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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