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FSB50760BSF

Onsemi

FSB50760BSF by Onsemi

FSB50760BSF by Onsemi is a Motion Control IC with 23 terminals, operating voltage range of 13.5V to 16.5V, and max output current of 9.4A. Ideal for automotive applications due to its hybrid technology, it functions as a brushless DC motor controller in compact MICROELECTRONIC ASSEMBLY package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,299 parts In-Stock

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11,299

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Digiode

USA . 637 parts In-Stock

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Native Components

USA . 883 parts In-Stock

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$0.062

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$0.060

883

$0.062

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$0.060

Northwest PG Solutions

USA . 56 parts In-Stock

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$0.069

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$0.060

56

$0.069

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$0.060

AZTECH Wire

Italy . 461 parts In-Stock

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$18.630

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461

$18.630

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TANS Electronics

Latvia . 7,521 parts In-Stock

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Problanco Electronics

Mexico . 5,283 parts In-Stock

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Corphita

USA . 2,173 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 1,579 parts In-Stock

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1,579

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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Kulean Microsystems

USA . 36 parts In-Stock

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Overview

Experience seamless motion control with the FSB50760BSF by Onsemi, a top-tier manufacturer known for delivering high-quality products. This brushless DC motor controller offers unparalleled precision and reliability, making it ideal for automotive applications. With a wide supply voltage range and advanced hybrid technology, this motion control IC ensures optimal performance in any environment. Trust Onsemi to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights of efficiency and innovation.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape provides ease of mounting and efficient use of space in electronic assemblies.

Nominal Supply Voltage (Vsup): 15 V

The 15V supply voltage is suitable for a wide range of applications, providing flexibility in powering the IC.

No. of Terminals: 23

The high number of terminals allows for multiple connections and functionalities, enhancing the versatility of the IC.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to operate effectively in extreme cold environments.

Maximum Seated Height: 3.3 mm

The low seated height enables compact design solutions and efficient use of space in electronic systems.

Width (mm): 12 mm

The compact width of 12mm makes the IC suitable for applications where space is limited.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Being a brushless DC motor controller, this IC offers efficient and precise control over motor operations, making it ideal for motion control applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the IC can withstand the temperature fluctuations and demands of automotive applications.

Technology: HYBRID

The hybrid technology used in this IC combines the benefits of different technologies, offering high performance and reliability.

Technical Specifications

Motion Control ICs FSB50760BSF attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-T23

Length:

29 mm

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

9.4 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

3.3 mm

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

12 mm

Trade Compliance

FSB50760BSF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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