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FQD19N10TM

Onsemi

FQD19N10TM by Onsemi

FQD19N10TM by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 62.4A, EAS of 220mJ, and ID of 15.6A. With a 0.1 ohm RDS(on), this ENHANCEMENT MODE transistor operates up to 150°C, making it suitable for high-power applications.

Median Price

$0.490

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,780 parts In-Stock

1+ parts

$0.490

100+ parts

$0.480

1k+ parts

$0.470

10k+ parts

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14,780

$0.490

$0.480

$0.470

-

Distributors (In-Stock)

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Digiode

USA . 2,139 parts In-Stock

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$2.928

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2,139

$2.928

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Chip Stock

USA . 18,000 parts In-Stock

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Sensible Micro Corp

USA . 6,822 parts In-Stock

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Flip Electronics

USA . 4,015 parts In-Stock

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4,015

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Cyclops Electronics Ltd

UK . 2,414 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 777 parts In-Stock

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777

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Bristol Electronics

USA . 777 parts In-Stock

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777

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Dan-Mar Components

USA . 777 parts In-Stock

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777

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Vyrian

USA . 357 parts In-Stock

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357

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Electronic Expediters

USA . 98 parts In-Stock

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98

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NPI Materials, Inc.

USA . 29 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,106 parts In-Stock

1+ parts

$0.589

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2,106

$0.589

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Ampacity Inc.

Singapore . 788 parts In-Stock

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$2.620

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788

$2.620

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Corphita

USA . 795 parts In-Stock

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$2.774

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795

$2.774

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Corohmni

South Africa . 380 parts In-Stock

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$3.082

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380

$3.082

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AZTECH Wire

Italy . 245 parts In-Stock

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$10.750

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$10.750

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Perfect Parts

USA . 106,434 parts In-Stock

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106,434

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,561 parts In-Stock

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Lixinc

USA . 12,120 parts In-Stock

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Kulean Microsystems

USA . 6,877 parts In-Stock

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SupplyDigital Components

Austria . 6,386 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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iodParts Technologies Inc.

India . 4,973 parts In-Stock

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Argo Parts USA

USA . 4,290 parts In-Stock

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4,290

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TANS Electronics

Latvia . 2,482 parts In-Stock

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2,482

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Alle Elektronik GmbH

Germany . 599 parts In-Stock

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599

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Continental Prestige Electronics

USA . 500 parts In-Stock

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500

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Problanco Electronics

Mexico . 166 parts In-Stock

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Supply Digital

USA . 157 parts In-Stock

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of efficient switching with the FQD19N10TM by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor with a built-in diode is designed for enhanced performance in various applications, offering a maximum pulsing drain current of 62.4A. With a low on-resistance of 0.1 ohm and a high power dissipation of 50W, this transistor is a valuable asset for your projects. Experience the benefits of Onsemi's cutting-edge technology and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the power FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher electron mobility, offering better performance than P-channel FETs in a variety of switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in controlling the reverse current flow and enhances the efficiency of the power FET in switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET ensures reliable and efficient performance when used in power management circuits.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Pulsed Drain Current (IDM): 62.4 A

The high pulsed drain current rating ensures the power FET can handle temporary peak loads without risking damage to the device.

Maximum Power Dissipation (Abs): 50 W

With a high power dissipation rating, this power FET can handle significant power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the power FET to operate in demanding environments without performance degradation, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) FQD19N10TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

15.6 A

Maximum Drain Current (ID):

15.6 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

62.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD19N10TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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