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FQA62N25C

Onsemi

FQA62N25C by Onsemi

FQA62N25C by Onsemi is a N-CHANNEL Power FET with 250V DS Breakdown Voltage and 62A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 298W Power Dissipation, and operates in ENHANCEMENT MODE. Suitable for high-power systems requiring efficient switching capabilities.

Median Price

$3.520

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 390 parts In-Stock

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$3.520

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$3.150

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$2.970

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$2.970

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Freelance Electronics

USA . 8 parts In-Stock

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$3.034

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$3.034

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Nova Conductors

Japan . 100 parts In-Stock

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$4.015

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Vyrian

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Classic Components Corporation

USA . 1,348 parts In-Stock

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Digiode

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Flip Electronics

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$1.067

100+ parts

$0.971

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$0.875

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10

$1.067

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Corohmni

South Africa . 409 parts In-Stock

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$3.034

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$3.034

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Aranea Global

USA . 2,000 parts In-Stock

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$3.935

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$3.777

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$3.935

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$3.777

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Continental Prestige Electronics

USA . 4,809 parts In-Stock

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$4.015

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$3.935

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$4.015

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Argo Parts USA

USA . 1,626 parts In-Stock

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$4.015

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AZTECH Wire

Italy . 381 parts In-Stock

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$10.438

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Semicontronic

India . 1,108 parts In-Stock

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$35.050

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$34.174

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$33.998

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$35.050

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Ampacity Inc.

Singapore . 1,170 parts In-Stock

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$57.050

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Problanco Electronics

Mexico . 6,981 parts In-Stock

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TANS Electronics

Latvia . 5,978 parts In-Stock

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Kulean Microsystems

USA . 3,284 parts In-Stock

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Corphita

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Supply Digital

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Perfect Parts

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SupplyDigital Components

Austria . 1,156 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,085 parts In-Stock

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UHIMA Technologies

Türkiye . 898 parts In-Stock

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Kepictronics

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 280 parts In-Stock

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Overview

Upgrade your power systems with the FQA62N25C by Onsemi, a top-quality Power Field Effect Transistor that delivers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL transistor is designed for switching applications with a minimum DS Breakdown Voltage of 250V. With a maximum Drain Current of 62A and an Avalanche Energy Rating of 2300mJ, this transistor offers exceptional power handling capabilities. Whether you're in need of enhanced efficiency or increased power output, the FQA62N25C provides the perfect solution for your needs. Choose Onsemi for superior quality and performance in your power systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the transistor, making it durable and long-lasting.

Minimum DS Breakdown Voltage: 250 V

The high breakdown voltage allows this transistor to withstand higher voltages without damage, making it suitable for a variety of applications.

Maximum Pulsed Drain Current (IDM): 248 A

With a high pulsed drain current rating, this transistor can handle sudden spikes in current without getting damaged, making it reliable in demanding scenarios.

Maximum Power Dissipation (Abs): 298 W

The high power dissipation rating ensures that this transistor can handle high power loads without overheating, making it suitable for power electronics applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this transistor to function effectively in extreme temperature conditions, increasing its versatility.

Technical Specifications

Power Field Effect Transistors (FET) FQA62N25C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2300 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

62 A

Maximum Drain Current (ID):

62 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

248 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA62N25C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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