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FPF3003UCX

Onsemi

FPF3003UCX by Onsemi

FPF3003UCX by Onsemi is a Power Management IC with 16 terminals in a square package. It has an adjustable threshold with supply voltage ranging from 2.3V to 5.5V, suitable for industrial applications requiring precise power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,349 parts In-Stock

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SPM Sales

USA . 2,098 parts In-Stock

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Digiode

USA . 2,093 parts In-Stock

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Native Components

USA . 564 parts In-Stock

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$0.124

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$0.119

564

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$0.119

Northwest PG Solutions

USA . 430 parts In-Stock

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$0.136

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430

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$0.120

Perfect Parts

USA . 19,909 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,779 parts In-Stock

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SupplyDigital Components

Austria . 6,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,626 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,045 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,084 parts In-Stock

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Supply Digital

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Kulean Microsystems

USA . 2,038 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 1,420 parts In-Stock

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 202 parts In-Stock

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Overview

Elevate your power management capabilities with the FPF3003UCX by Onsemi, a top-tier manufacturer known for delivering high-quality Power Management ICs. This versatile product is perfect for a wide range of applications, providing customers with reliability and efficiency like never before. With its advanced features and superior design, the FPF3003UCX offers unmatched value and benefits, making it the ideal choice for all your power supply support circuit needs. Trust Onsemi to deliver innovation and excellence in every component they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 4.2 V

The nominal supply voltage of 4.2 V is suitable for a wide range of applications, providing flexibility in power input.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable electrical connections.

Maximum Seated Height: 0.625 mm

The low maximum seated height contributes to a compact design, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.3 V

The minimum supply voltage of 2.3 V allows for operation in low-power scenarios, enhancing the product's versatility.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable soldering during assembly, ensuring a robust electrical connection.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product meets the stringent performance and reliability requirements of industrial applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, making the product versatile for various applications.

Adjustable Threshold: YES

The ability to adjust the threshold voltage offers flexibility in power management settings, catering to different system requirements.

Technical Specifications

Power Management ICs FPF3003UCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

LOBAT THRESHOLD VOLTAGE IS 0.8V

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e1

Length:

1.56 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.56 mm

Trade Compliance

FPF3003UCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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