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FPF34891UCX

Onsemi

FPF34891UCX by Onsemi

FPF34891UCX by Onsemi is a Power Management IC with 28 terminals, operating b/w -40 to 85 °C. It supports a supply voltage range of 2.7V to 13.5V and features a compact rectangular package ideal for industrial applications requiring precise power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 912 parts In-Stock

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Digiode

USA . 809 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 914 parts In-Stock

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$0.348

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$0.334

914

$0.348

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$0.334

Northwest PG Solutions

USA . 2,003 parts In-Stock

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$0.383

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$0.338

2,003

$0.383

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$0.338

SupplyDigital Components

Austria . 5,584 parts In-Stock

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Kulean Microsystems

USA . 4,646 parts In-Stock

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4,646

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Problanco Electronics

Mexico . 1,525 parts In-Stock

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Corphita

USA . 1,335 parts In-Stock

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TANS Electronics

Latvia . 678 parts In-Stock

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UHIMA Technologies

Türkiye . 503 parts In-Stock

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Corohmni

South Africa . 401 parts In-Stock

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Overview

Enhance your power management capabilities with the FPF34891UCX by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers innovative solutions in the Power Management ICs category. This ultra-thin profile IC offers a wide range of applications, ensuring optimal performance in various settings. With its advanced features and industrial-grade temperature grade, the FPF34891UCX provides unmatched value and benefits to customers looking to streamline their power supply support circuits. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal conductivity and electrical insulation, making the product reliable and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 5 V

A common and stable supply voltage of 5V ensures compatibility with a wide range of devices and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions without overheating.

No. of Terminals: 28

Having a high number of terminals allows for multiple connections and functionalities, making the product versatile in various power management applications.

Width (mm): 1.67 mm

The ultra-thin profile and fine pitch width of 1.67mm help in saving space on the circuit board and enable compact designs.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V enables operation in low-power scenarios, enhancing efficiency and flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product's reliability and performance in demanding industrial environments.

No. of Channels: 2

Having two channels allows for independent control and monitoring of different power circuits, increasing the product's functionality.

Maximum Supply Voltage (Vsup): 13.5 V

The high maximum supply voltage of 13.5V provides flexibility in handling higher voltage applications, making the product versatile.

Technical Specifications

Power Management ICs FPF34891UCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B28

Length:

2.96 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA28,4X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

Maximum Seated Height:

.612 mm

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

1.67 mm

Trade Compliance

FPF34891UCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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