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FPF1C2P5BF07A

Onsemi

FPF1C2P5BF07A by Onsemi

FPF1C2P5BF07A by Onsemi is an N-CHANNEL Power FET with 650V DS Breakdown Voltage and 156A IDM. Ideal for POWER CONTROL applications, it features a max power dissipation of 250W, 0.09 ohm RDS(on), and operates b/w -40 to 150 °C.

Median Price

$66.810

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 433 parts In-Stock

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$46.940

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$42.020

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433

$46.940

$42.020

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Rochester

USA . 433 parts In-Stock

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-

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$66.810

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$59.780

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$56.260

433

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$66.810

$59.780

$56.260

DigiKey

USA . 433 parts In-Stock

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433

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Verical

USA . 433 parts In-Stock

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$83.513

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433

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$83.513

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Distributors (In-Stock)

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Digiode

USA . 398 parts In-Stock

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$44.593

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398

$44.593

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DigiKey Marketplace

USA . 433 parts In-Stock

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$77.390

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Vyrian

USA . 8,922 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 161 parts In-Stock

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$1.711

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161

$1.711

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$2.031

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$1.848

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$1.665

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870

$2.031

$1.848

$1.665

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Corphita

USA . 276 parts In-Stock

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$42.246

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$42.246

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Continental Prestige Electronics

USA . 433 parts In-Stock

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$46.940

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Microchip USA

USA . 5,933 parts In-Stock

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Problanco Electronics

Mexico . 8,174 parts In-Stock

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TANS Electronics

Latvia . 8,159 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Kulean Microsystems

USA . 2,615 parts In-Stock

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Northwest PG Solutions

USA . 631 parts In-Stock

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SupplyDigital Components

Austria . 520 parts In-Stock

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Native Components

USA . 77 parts In-Stock

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Overview

Unleash the power of innovation with the FPF1C2P5BF07A by Onsemi! As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers unparalleled quality and reliability. Ideal for power control applications, this complex N-CHANNEL transistor offers customers exceptional value and benefits. With a high DS breakdown voltage, maximum pulsated drain current, and low drain-source on resistance, this product ensures optimal performance in a wide range of industrial settings. Trust Onsemi to provide cutting-edge technology that meets the highest industry standards.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speed, making this product a good choice for power control applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high power applications, ensuring reliability and safety.

Maximum Drain Current (Abs): 36 A

With a high drain current rating, this FET can handle large current loads, making it suitable for power control applications.

Maximum Power Dissipation (Abs): 250 W

The high power dissipation capability of this FET allows it to operate efficiently in high-power environments without overheating.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can function reliably in a wide range of temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) FPF1C2P5BF07A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X24

No. of Elements:

5

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

PRESS FIT

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Trade Compliance

FPF1C2P5BF07A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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