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FODM8061

Onsemi

FODM8061 by Onsemi

The Onsemi FODM8061 is a single optocoupler with a max forward current of 0.05A and an isolation voltage of 3750V. With a nominal data rate of 10MBps, it is ideal for logic IC output applications requiring fast response times. Operating b/w -40 to 110 °C, this surface mount device offers reliable performance in various temperature conditions.

Median Price

$2.770

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,264 parts In-Stock

1+ parts

$2.770

100+ parts

$1.559

1k+ parts

$1.295

10k+ parts

$1.180

2,264

$2.770

$1.559

$1.295

$1.180

Mouser Electronics

USA . 2,214 parts In-Stock

1+ parts

$2.770

100+ parts

$1.560

1k+ parts

$1.240

10k+ parts

-

2,214

$2.770

$1.560

$1.240

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Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.170

10k+ parts

$1.040

1

-

$1.410

$1.170

$1.040

Distributors (In-Stock)

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Digiode

USA . 1,099 parts In-Stock

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$1.102

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1,099

$1.102

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Vyrian

USA . 2,396 parts In-Stock

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$1.160

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2,396

$1.160

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TME

Poland . 856 parts In-Stock

1+ parts

$2.630

100+ parts

$1.680

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856

$2.630

$1.680

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Chip Stock

USA . 10,378 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$1.510

6,000

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$1.510

Flip Electronics

USA . 1,805 parts In-Stock

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1,805

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Sensible Micro Corp

USA . 430 parts In-Stock

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430

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North Shore Components

USA . 370 parts In-Stock

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370

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Cyclops Electronics Ltd

UK . 86 parts In-Stock

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ComSIT Distribution GmbH

Germany . 46 parts In-Stock

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46

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Prism Electronics

USA . 35 parts In-Stock

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35

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,872 parts In-Stock

1+ parts

$0.990

100+ parts

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3,872

$0.990

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Corphita

USA . 1,227 parts In-Stock

1+ parts

$1.044

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1,227

$1.044

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Corohmni

South Africa . 108 parts In-Stock

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$1.160

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108

$1.160

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Component Stockers USA

USA . 8,506 parts In-Stock

1+ parts

$1.190

100+ parts

$1.450

1k+ parts

$1.130

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8,506

$1.190

$1.450

$1.130

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Native Components

USA . 533 parts In-Stock

1+ parts

$14.120

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533

$14.120

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Northwest PG Solutions

USA . 596 parts In-Stock

1+ parts

$15.532

100+ parts

$13.979

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596

$15.532

$13.979

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QUARKTWIN TECHNOLOGY LTD

USA . 15,304 parts In-Stock

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Problanco Electronics

Mexico . 7,963 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 6,586 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,979 parts In-Stock

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Kulean Microsystems

USA . 5,274 parts In-Stock

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Metaverse IC Inc.

Canada . 4,220 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,986 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 2,340 parts In-Stock

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iodParts Technologies Inc.

India . 2,175 parts In-Stock

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$2.180

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TANS Electronics

Latvia . 1,925 parts In-Stock

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Supply Digital

USA . 1,871 parts In-Stock

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Allen Electronics Distributors

USA . 622 parts In-Stock

1+ parts

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$1.254

1k+ parts

$0.906

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622

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$1.254

$0.906

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UHIMA Technologies

Türkiye . 400 parts In-Stock

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400

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Overview

Unlock the potential of your electronic projects with the FODM8061 by Onsemi. Crafted with precision and expertise, this optocoupler circuit output offers unparalleled quality and reliability. From ensuring signal isolation to enhancing noise immunity, this product is designed to meet the demands of modern electronics. Whether you're working on industrial controls or automotive applications, the FODM8061 delivers exceptional performance and peace of mind. Trust in Onsemi's reputation for excellence and elevate your projects with this cutting-edge solution.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to use and integrate into different systems.

Maximum Forward Current: 0.05 A

Can handle high forward currents, ensuring reliable operation.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Designed specifically for logic IC outputs, ensuring compatibility and efficient signal transfer.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement allows for flexibility in power source selection.

Maximum Operating Temperature: 110 °C

Wide operating temperature range makes this optocoupler suitable for various environments and applications.

Nominal Response Time: 80 ns

Fast response time ensures quick signal transmission and high-speed performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, making it versatile for different conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for reliable connections.

Maximum Power Dissipation: 0.085 W

Low power dissipation helps in efficient energy usage and heat management.

Nominal Supply Voltage: 5.5 V

Works efficiently within a standard supply voltage range for easy integration.

Maximum Isolation Voltage: 3750 V

High isolation voltage ensures safe operation and protection against voltage spikes.

Nominal Data Rate: 10 MBps

High data rate capability allows for fast and reliable data transmission.

Mounting Feature: SURFACE MOUNT

Surface mount design enables easy and secure installation on PCBs.

Maximum On State Current: 0.05 A

Can handle high on-state currents, ensuring stable and consistent performance.

Technical Specifications

Optocoupler Circuit Outputs FODM8061 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE, UL RECOGNIZED

Configuration:

SINGLE

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.05 A

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.085 W

Nominal Response Time:

80 ns

Sub-Category:

Optocoupler - IC Outputs

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5.5 V

Terminal Finish:

Trade Compliance

FODM8061 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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