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FODM3052R2V_NF098

Onsemi

FODM3052R2V_NF098 by Onsemi

FODM3052R2V_NF098 by Onsemi is a single TRIAC output optocoupler with a max forward current of 0.06A and isolation voltage of 3750V. It operates b/w -40 to 100 °C, ideal for triggering devices in high-voltage applications like industrial control systems and power supplies.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$1.830

100+ parts

$0.992

1k+ parts

$0.808

10k+ parts

$0.712

2,500

$1.830

$0.992

$0.808

$0.712

Mouser Electronics

USA . 2,500 parts In-Stock

1+ parts

$1.830

100+ parts

$0.968

1k+ parts

$0.782

10k+ parts

$0.629

2,500

$1.830

$0.968

$0.782

$0.629

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 429 parts In-Stock

1+ parts

$1.890

100+ parts

-

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429

$1.890

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Vyrian

USA . 2,606 parts In-Stock

1+ parts

$1.990

100+ parts

-

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2,606

$1.990

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 2,161 parts In-Stock

1+ parts

$1.791

100+ parts

-

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2,161

$1.791

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Corohmni

South Africa . 271 parts In-Stock

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$1.990

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271

$1.990

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Component Stockers USA

USA . 9,749 parts In-Stock

1+ parts

$9.440

100+ parts

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9,749

$9.440

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Kulean Microsystems

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Problanco Electronics

Mexico . 6,407 parts In-Stock

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6,407

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SupplyDigital Components

Austria . 4,353 parts In-Stock

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4,353

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,774 parts In-Stock

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2,774

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Northwest PG Solutions

USA . 506 parts In-Stock

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506

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Native Components

USA . 427 parts In-Stock

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427

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Supply Digital

USA . 85 parts In-Stock

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85

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UHIMA Technologies

Türkiye . 65 parts In-Stock

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Overview

Unlock the potential of your electronics with the FODM3052R2V_NF098 by Onsemi. Manufactured with precision and expertise, this optocoupler trigger device output is designed for maximum performance and reliability. Whether you're working on industrial automation, power management systems, or lighting controls, this product offers unmatched value with its superior quality and wide range of applications. Experience the benefits of seamless integration, enhanced efficiency, and unparalleled safety with the Onsemi FODM3052R2V_NF098. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration allows for easy integration and control in various applications.

Maximum Forward Current: 0.06 A

Can handle high forward currents, making it suitable for demanding applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler design enables efficient and reliable signal transmission.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures stable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in both hot and cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good connectivity and corrosion resistance.

Nominal Input Trigger Current: 10 mA

Low input trigger current requirement for efficient control and operation.

Minimum Peak Off-state Voltage: 600 V

High minimum peak off-state voltage ensures safety and reliability in high voltage applications.

Maximum Isolation Voltage: 3750 V

High isolation voltage protects sensitive components from voltage spikes and interference.

Maximum On State Current: 0.07 A

Capable of handling high on-state currents for effective output control.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3052R2V_NF098 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Nominal Input Trigger Current:

10 mA

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Minimum Peak Off-state Voltage:

600 V

Terminal Finish:

Trade Compliance

FODM3052R2V_NF098 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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