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FODM3012

Onsemi

FODM3012 by Onsemi

The Onsemi FODM3012 is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 to 100°C, has an isolation voltage of 3750V, and is suitable for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 7,373 parts In-Stock

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$0.290

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$0.280

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$0.280

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7,373

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Digiode

USA . 1,829 parts In-Stock

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Vyrian

USA . 951 parts In-Stock

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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Bristol Electronics

USA . 70 parts In-Stock

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$0.561

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Prism Electronics

USA . 36 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 579 parts In-Stock

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$8.541

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$8.541

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Andel Nordic

Denmark . 3,531 parts In-Stock

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$9.761

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$9.370

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$9.370

3,531

$9.761

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$9.370

$9.370

Ampacity Inc.

Singapore . 305 parts In-Stock

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$18.100

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,233 parts In-Stock

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TANS Electronics

Latvia . 7,923 parts In-Stock

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SupplyDigital Components

Austria . 3,493 parts In-Stock

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Corphita

USA . 3,360 parts In-Stock

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Problanco Electronics

Mexico . 2,404 parts In-Stock

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Kulean Microsystems

USA . 2,305 parts In-Stock

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Kepictronics

USA . 1,131 parts In-Stock

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Supply Digital

USA . 940 parts In-Stock

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UHIMA Technologies

Türkiye . 267 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Elevate your electronics projects with the FODM3012 optocoupler trigger device by Onsemi. Designed for precision and reliability, this TRIAC output optocoupler offers seamless integration and control in a variety of applications. With a maximum isolation voltage of 3750 V and a compact surface mount design, the FODM3012 provides unparalleled performance and safety. Say goodbye to electrical interference and hello to seamless connectivity with Onsemi's top-notch manufacturing quality. Experience the difference today and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage ensures safe operation and protection of connected components.

Configuration: SINGLE

Single configuration simplifies wiring and setup, making it easier to use.

Maximum Forward Current: 0.06 A

Sufficient forward current for reliable triggering of connected devices.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers precise control and compatibility with various applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various temperature conditions.

Maximum Input Trigger Current: 0.005 A

Low trigger current requirement for efficient operation and reduced power consumption.

Repetitive Off-state Voltage (Peak): 250 V

High off-state voltage rating provides protection against voltage spikes and surges.

Packing Method: TUBE

Tube packaging ensures safe transportation and storage of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current prevents unwanted current flow when the device is in the off state.

Maximum Isolation Voltage: 3750 V

High isolation voltage rating ensures safe separation between input and output circuits.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and allows for compact and space-saving integration.

Maximum On State Current: 0.07 A

Higher on state current capability for handling larger loads with ease.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3012 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3012 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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