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FOD819SD

Onsemi

FOD819SD by Onsemi

The Onsemi FOD819SD is a single optocoupler with a max forward current of 0.05A and min CTR of 100%. It operates b/w -55°C to 110°C, ideal for surface mount applications requiring high isolation voltage up to 5000V.

Median Price

$0.401

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 942 parts In-Stock

1+ parts

$0.930

100+ parts

$0.476

1k+ parts

$0.319

10k+ parts

$0.283

942

$0.930

$0.476

$0.319

$0.283

Rochester

USA . 7,501 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

7,501

-

$0.357

$0.296

$0.264

Verical

USA . 5,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.370

5,001

-

-

$0.401

$0.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,077 parts In-Stock

1+ parts

$0.277

100+ parts

-

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2,077

$0.277

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Vyrian

USA . 3,396 parts In-Stock

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3,396

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Flip Electronics

USA . 970 parts In-Stock

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970

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 840 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

840

$0.174

-

-

$0.167

Northwest PG Solutions

USA . 517 parts In-Stock

1+ parts

$0.191

100+ parts

-

1k+ parts

-

10k+ parts

$0.169

517

$0.191

-

-

$0.169

Ampacity Inc.

Singapore . 6,992 parts In-Stock

1+ parts

$0.248

100+ parts

-

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6,992

$0.248

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Corphita

USA . 1,772 parts In-Stock

1+ parts

$0.263

100+ parts

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1,772

$0.263

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$0.292

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134

$0.292

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TANS Electronics

Latvia . 8,231 parts In-Stock

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8,231

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Kulean Microsystems

USA . 7,135 parts In-Stock

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7,135

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Perfect Parts

USA . 2,195 parts In-Stock

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2,195

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Problanco Electronics

Mexico . 2,169 parts In-Stock

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2,169

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UHIMA Technologies

Türkiye . 808 parts In-Stock

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808

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SupplyDigital Components

Austria . 126 parts In-Stock

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126

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Overview

Experience the superior quality and reliability of Onsemi with the FOD819SD Optocoupler Transistor Output. This innovative product offers a seamless single configuration, making it ideal for a wide range of applications. With a high minimum current transfer ratio of 100% and maximum isolation voltage of 5000V, this optoelectronic component ensures optimal performance and safety. Trust in Onsemi's expertise to deliver cutting-edge technology that exceeds expectations and provides unmatched value to our customers. Elevate your projects with the FOD819SD today.

Feature Benefit Bullets

Configuration: SINGLE

This optocoupler has a single configuration, which makes it easy to use and integrate into various electronic circuits.

Maximum Forward Current: 0.05 A

With a high maximum forward current capacity, this optocoupler can handle a significant amount of current, making it suitable for a wide range of applications.

Optoelectronic Type: TRANSISTOR OUTPUT OPTOCOUPLER

Being a transistor output optocoupler, this product provides high reliability and performance in applications that require transistor switching.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature allows this optocoupler to operate efficiently even in demanding environments.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this optocoupler can still function reliably in cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Power Dissipation: 0.15 W

With a low maximum power dissipation, this optocoupler is energy-efficient and reduces heat generation during operation.

Minimum Current Transfer Ratio: 100 %

The high minimum current transfer ratio ensures accurate and efficient signal transmission between the input and output sides of the optocoupler.

Maximum Dark Current: 100 nA

The low maximum dark current minimizes unwanted current flow in the absence of input signals, improving overall performance and reliability.

Packing Method: TR

The TR packing method ensures easy handling, storage, and transportation of the optocoupler, making it convenient for production and assembly processes.

Minimum Collector-emitter Breakdown Voltage: 80 V

With a high minimum collector-emitter breakdown voltage, this optocoupler can safely handle high voltage applications without the risk of electrical breakdown.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage provides excellent electrical isolation between input and output circuits, minimizing the risk of interference or damage.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation of the optocoupler on PCBs, saving space and simplifying assembly.

Maximum Forward Voltage: 1.4 V

With a low maximum forward voltage, this optocoupler minimizes power loss and heat generation, improving overall efficiency and reliability.

Maximum On State Current: 0.03 A

The high maximum on-state current allows this optocoupler to handle continuous current flow effectively, making it suitable for various load switching applications.

Technical Specifications

Optocoupler Transistor Outputs FOD819SD attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Minimum Collector-emitter Breakdown Voltage:

80 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

100 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.03 A

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-55 Cel

Optoelectronic Type:

Packing Method:

TR

Maximum Power Dissipation:

.15 W

Terminal Finish:

Trade Compliance

FOD819SD Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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