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FOD817C300

Onsemi

FOD817C300 by Onsemi

FOD817C300 by Onsemi is a single optocoupler with a max forward current of 0.05A and min operating temp of -55°C, ideal for applications requiring high isolation voltage up to 5000V. With a response time of 18μs and collector-emitter breakdown voltage of 70V, it's suitable for through-hole mounting in various electronic circuits.

Median Price

$0.169

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,932 parts In-Stock

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$0.420

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$0.208

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$0.168

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$0.111

2,932

$0.420

$0.208

$0.168

$0.111

DigiKey

USA . 795 parts In-Stock

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$0.420

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$0.208

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$0.157

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$0.128

795

$0.420

$0.208

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$0.128

Newark

USA . 1,390 parts In-Stock

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$0.433

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$0.213

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$0.162

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$0.132

1,390

$0.433

$0.213

$0.162

$0.132

Adafruit Industries

USA . 150 parts In-Stock

1+ parts

$0.494

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$0.470

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$0.470

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$0.494

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$0.470

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Flip Electronics (Authorized)

USA . 22,000 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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Rochester

USA . 6,000 parts In-Stock

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$0.133

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$0.110

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$0.098

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Arrow

USA . 4,000 parts In-Stock

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Farnell

UK . 1,159 parts In-Stock

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Element14

Singapore . 1,159 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Maritex

Poland . 2,982 parts In-Stock

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$0.110

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TME

Poland . 384 parts In-Stock

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$0.390

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$0.213

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$0.148

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$0.146

384

$0.390

$0.213

$0.148

$0.146

Digiode

USA . 2,435 parts In-Stock

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$0.469

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Flip Electronics

USA . 13,800 parts In-Stock

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Cyclops Electronics Ltd

UK . 12,100 parts In-Stock

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Vyrian

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NAC Semi

USA . 4,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 535 parts In-Stock

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Bristol Electronics

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Amar Radio Corporation

India . 22 parts In-Stock

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Semicontronic

India . 4,415 parts In-Stock

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$0.082

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$0.080

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Ampacity Inc.

Singapore . 4,174 parts In-Stock

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Corohmni

South Africa . 386 parts In-Stock

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Argo Parts USA

USA . 4,924 parts In-Stock

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$0.145

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Continental Prestige Electronics

USA . 1,836 parts In-Stock

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$0.147

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 1,167 parts In-Stock

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$0.445

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$0.494

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$0.470

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Aztec Data Supply Inc.

USA . 4,608 parts In-Stock

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$0.667

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Perfect Parts

USA . 242,814 parts In-Stock

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Metaverse IC Inc.

Canada . 63,839 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 6,246 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

Mexico . 3,450 parts In-Stock

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Lixinc

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TANS Electronics

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Supply Digital

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S.R.D Solutions

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Kulean Microsystems

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UHIMA Technologies

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality FOD817C300 optocoupler by Onsemi. This single configuration device offers reliable performance and precise control in a wide range of applications. With a minimum current transfer ratio of 200% and maximum isolation voltage of 5000V, this optocoupler provides exceptional value and benefits to customers looking for efficient signal transmission and noise reduction. Trust Onsemi's reputation for excellence and choose the FOD817C300 for your next project.

Feature Benefit Bullets

Configuration: SINGLE

This optocoupler has a single configuration, making it easy to integrate into circuits and ensuring simplicity in design.

Maximum Forward Current: 0.05 A

The high maximum forward current capability allows for efficient operation and handling of current load requirements.

Optoelectronic Type: TRANSISTOR OUTPUT OPTOCOUPLER

The transistor output optocoupler type provides reliable switching and isolation between input and output signals.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this optocoupler can withstand challenging environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures functionality in a wide range of temperature settings.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good conductivity and durability for secure connections.

Maximum Power Dissipation: 0.15 W

The low power dissipation helps in reducing heat buildup and energy consumption, making it efficient for various applications.

Minimum Current Transfer Ratio: 200 %

The high minimum current transfer ratio ensures accurate signal transmission and minimal signal loss.

Maximum Dark Current: 100 nA

The low maximum dark current minimizes leakage current in dark conditions, ensuring reliable performance.

Packing Method: TUBE

The tube packing method provides protection during transportation and storage, keeping the optocoupler safe from damage.

Maximum Response Time: 0.000018 s

The fast response time allows for quick switching and operation, making it suitable for high-speed applications.

Minimum Collector-emitter Breakdown Voltage: 70 V

The high minimum collector-emitter breakdown voltage ensures reliable performance and protection against voltage spikes.

Nominal Current Transfer Ratio: 200 %

The high nominal current transfer ratio ensures consistent and accurate signal transmission between input and output.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage provides effective isolation between input and output signals, enhancing safety and reliability.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for easy and secure installation on PCBs, ensuring stability and durability.

Maximum Forward Voltage: 1.4 V

The low maximum forward voltage drop helps in reducing power loss and improving efficiency in circuit designs.

Maximum On State Current: 0.05 A

The high maximum on-state current capability ensures reliable switching and handling of current loads during operation.

Technical Specifications

Optocoupler Transistor Outputs FOD817C300 attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Minimum Collector-emitter Breakdown Voltage:

70 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

200 %

Nominal Current Transfer Ratio:

200 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.05 A

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-55 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.000018 s

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FOD817C300 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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