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FOD410

Onsemi

FOD410 by Onsemi

FOD410 by Onsemi is a single TRIAC output optocoupler with 3V max on-state voltage and 3A peak surge current. Ideal for applications requiring optoelectronic isolation, it operates b/w -55°C to 100°C. With a max isolation voltage of 5000V, it is suitable for through-hole mounting in various electronic devices.

Median Price

$2.030

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 228 parts In-Stock

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$1.350

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228

$1.350

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Chip1Stop

Japan . 228 parts In-Stock

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$2.030

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$2.030

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DigiKey

USA . 737 parts In-Stock

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$4.360

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$2.551

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$2.162

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$1.994

737

$4.360

$2.551

$2.162

$1.994

Mouser Electronics

USA . 235 parts In-Stock

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$4.360

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$2.270

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$1.900

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$1.890

235

$4.360

$2.270

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$1.890

Flip Electronics (Authorized)

USA . 1,880 parts In-Stock

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Rochester

USA . 568 parts In-Stock

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$1.810

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$1.620

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$1.530

568

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$1.530

Verical

USA . 228 parts In-Stock

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Digiode

USA . 1,543 parts In-Stock

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$1.451

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$1.451

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Nova Conductors

Japan . 71 parts In-Stock

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$2.015

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Flip Electronics

USA . 1,880 parts In-Stock

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Vyrian

USA . 286 parts In-Stock

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Prism Electronics

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Aztec Data Supply Inc.

USA . 814 parts In-Stock

1+ parts

$0.160

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814

$0.160

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Ampacity Inc.

Singapore . 177 parts In-Stock

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$1.310

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177

$1.310

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Semicontronic

India . 177 parts In-Stock

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$1.310

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$1.277

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$1.271

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177

$1.310

$1.277

$1.271

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Corphita

USA . 2,303 parts In-Stock

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$1.374

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$1.374

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Corohmni

South Africa . 240 parts In-Stock

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$1.509

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Continental Prestige Electronics

USA . 5,917 parts In-Stock

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$2.015

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$1.975

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$2.015

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Argo Parts USA

USA . 2,278 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Lixinc

USA . 11,058 parts In-Stock

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Kulean Microsystems

USA . 6,821 parts In-Stock

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Problanco Electronics

Mexico . 6,305 parts In-Stock

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TANS Electronics

Latvia . 4,685 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Assy Fe

Spain . 3,001 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 2,188 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 1,399 parts In-Stock

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UHIMA Technologies

Türkiye . 837 parts In-Stock

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FE SAS

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Overview

Upgrade your electronics with the FOD410 by Onsemi, a high-quality optocoupler trigger device output that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is designed for a wide range of applications where precise isolation and switching capabilities are required. With its peak surge current of 3A and maximum forward current of 0.03A, the FOD410 ensures superior functionality and efficiency. Experience the value and benefits of seamless integration and precise control with the FOD410, setting new standards in performance and reliability. Elevate your projects with Onsemi's FOD410 today!

Feature Benefit Bullets

Maximum On State Voltage: 3 V

The low maximum on state voltage of 3V ensures efficient operation and reduces power consumption.

Configuration: SINGLE

Single configuration simplifies installation and integration in various electronic circuits.

Peak Surge Current: 3 A

High peak surge current capability ensures reliability during sudden voltage spikes or surge events.

Maximum Forward Current: 0.03 A

Low maximum forward current results in minimal power dissipation and heat generation.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

This specific type of optocoupler provides efficient switching performance with zero-cross voltage recognition.

Maximum Operating Temperature: 100°C

High maximum operating temperature range allows for use in a wide range of environmental conditions.

Minimum Operating Temperature: -55°C

Low minimum operating temperature ensures functionality even in extremely cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures reliable connections.

Maximum Input Trigger Current: 0.002 A

Low maximum input trigger current allows for precise triggering and control of the device.

Repetitive Off-state Voltage (Peak): 600 V

High repetitive off-state voltage rating enhances safety and protection against voltage fluctuations.

Packing Method: TUBE

Tube packing method facilitates easy handling, storage, and transport of the product.

Nominal Input Trigger Current: 0.65 mA

The nominal input trigger current specification ensures consistent and reliable device performance.

Maximum Reverse Leakage Current: 0.00001 A

Extremely low maximum reverse leakage current enhances device efficiency and reduces power losses.

Minimum Peak Off-state Voltage: 600 V

High minimum peak off-state voltage ensures enhanced safety and protection against voltage spikes.

Maximum Isolation Voltage: 5000 V

High maximum isolation voltage provides excellent protection against electrical shock and interference.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable installation in electronic circuits.

Maximum On State Current: 0.07 A

Low maximum on-state current helps in reducing power consumption and heat dissipation.

Technical Specifications

Optocoupler Trigger Device Outputs FOD410 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Maximum Forward Current:

.03 A

Maximum Input Trigger Current:

.002 A

Nominal Input Trigger Current:

.65 mA

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

3 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.00001 A

Sub-Category:

Optocoupler - Trigger Device Outputs

Terminal Finish:

Trade Compliance

FOD410 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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