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FOD050LV

Onsemi

FOD050LV by Onsemi

The Onsemi FOD050LV is a single optocoupler with max forward current of 0.025A and isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -40 to 85 °C temperature range and requires min supply voltage of 7V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,508 parts In-Stock

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Vyrian

USA . 893 parts In-Stock

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Andel Nordic

Denmark . 2,291 parts In-Stock

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$3.805

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$3.653

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Problanco Electronics

Mexico . 3,249 parts In-Stock

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Kulean Microsystems

USA . 3,086 parts In-Stock

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Supply Digital

USA . 2,875 parts In-Stock

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Corphita

USA . 1,691 parts In-Stock

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Northwest PG Solutions

USA . 1,513 parts In-Stock

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TANS Electronics

Latvia . 1,145 parts In-Stock

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SupplyDigital Components

Austria . 1,123 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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Native Components

USA . 380 parts In-Stock

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Corohmni

South Africa . 233 parts In-Stock

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Overview

Experience seamless and reliable connectivity with the FOD050LV by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and precision engineering in every product. Optocoupler Circuit Outputs like the FOD050LV offer a wide range of applications, from industrial automation to power management systems. With a maximum isolation voltage of 2500V and a compact surface mount design, this optocoupler provides superior performance and peace of mind for your projects. Trust Onsemi for innovative solutions that deliver value and efficiency to your designs. Elevate your work with the FOD050LV today.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into circuits without the need for additional components or complex wiring.

Maximum Forward Current: 0.025 A

The high maximum forward current allows for reliable performance and handling of higher currents in the circuit.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

This optocoupler is specifically designed for logic IC output, ensuring compatibility and efficient signal transmission.

Minimum Supply Voltage: 7 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources and simplifies circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in elevated temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold environments.

Packing Method: TUBE

The tube packaging method provides protection during storage and transportation, reducing the risk of damage to the product.

Maximum Isolation Voltage: 2500 V

The high maximum isolation voltage ensures safe and reliable isolation between input and output circuits, protecting sensitive components.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Maximum On State Current: 0.008 A

The low maximum on-state current helps in minimizing power consumption and heat generation, making the product energy-efficient.

Technical Specifications

Optocoupler Circuit Outputs FOD050LV attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

2500 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Supply Voltage:

7 V

Trade Compliance

FOD050LV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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