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FOD053LR2V

Onsemi

FOD053LR2V by Onsemi

FOD053LR2V by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It has a max forward current of 0.025A and max isolation voltage of 2500V. Ideal for applications requiring surface mounting, with operating temperatures ranging from -40 °C to 85°C.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,765 parts In-Stock

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Digiode

USA . 308 parts In-Stock

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Andel Nordic

Denmark . 1,121 parts In-Stock

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$5.507

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$5.287

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SupplyDigital Components

Austria . 6,603 parts In-Stock

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Problanco Electronics

Mexico . 3,541 parts In-Stock

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Kulean Microsystems

USA . 3,360 parts In-Stock

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TANS Electronics

Latvia . 2,060 parts In-Stock

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Northwest PG Solutions

USA . 1,986 parts In-Stock

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Corphita

USA . 1,848 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 810 parts In-Stock

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Native Components

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Corohmni

South Africa . 450 parts In-Stock

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Overview

Discover the unmatched quality and reliability of the FOD053LR2V by Onsemi, an industry leader in optocoupler circuit outputs. With its separate configuration and two channels, this product is designed to provide superior performance and precision in a variety of applications. From industrial automation to automotive systems, this logic IC output optocoupler offers unparalleled value, benefits, and advantages to customers seeking top-notch quality and efficiency. Trust Onsemi for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate, 2 channels allows for independent operation of each channel, providing versatility in usage.

Maximum Forward Current: 0.025 A

With a maximum forward current of 0.025 A, this optocoupler circuit output can handle high current requirements efficiently.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler makes this product suitable for connecting logic circuits and isolating them from high voltages.

Minimum Supply Voltage: 7 V

With a minimum supply voltage of 7 V, this optocoupler circuit output can operate effectively even with lower voltage sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can withstand elevated temperatures without risking damage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable operation in cold environments.

Maximum Isolation Voltage: 2500 V

With a maximum isolation voltage of 2500 V, this optocoupler circuit output can provide effective electrical isolation between input and output circuits.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and saves space on circuit boards, making it convenient for compact designs.

Maximum On State Current: 0.008 A

The maximum on-state current of 0.008 A ensures efficient switching performance and reliable operation of the circuit output.

Technical Specifications

Optocoupler Circuit Outputs FOD053LR2V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

2500 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.008 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Minimum Supply Voltage:

7 V

Trade Compliance

FOD053LR2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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