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FOD050LSDV

Onsemi

FOD050LSDV by Onsemi

The Onsemi FOD050LSDV is a single optocoupler with a max forward current of 0.025A and isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -40 °C to 85°C, with a max on-state current of 0.008A.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,759 parts In-Stock

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Vyrian

USA . 2,473 parts In-Stock

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TANS Electronics

Latvia . 7,486 parts In-Stock

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Problanco Electronics

Mexico . 6,972 parts In-Stock

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Kulean Microsystems

USA . 6,127 parts In-Stock

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SupplyDigital Components

Austria . 5,301 parts In-Stock

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Supply Digital

USA . 2,325 parts In-Stock

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Northwest PG Solutions

USA . 1,088 parts In-Stock

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Native Components

USA . 868 parts In-Stock

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Corphita

USA . 596 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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UHIMA Technologies

Türkiye . 81 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the FOD050LSDV by Onsemi, a leading manufacturer in the industry. This single optocoupler circuit output offers a wide range of applications, providing seamless integration into various systems. With a maximum isolation voltage of 2500V and a maximum operating temperature of 85 °C, this product ensures optimal performance and safety. Trust in Onsemi's expertise to deliver exceptional value and benefits to meet your needs efficiently and effectively.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies the design and installation process, making the product easy to use.

Maximum Forward Current: 0.025 A

High maximum forward current allows for reliable operation of the optocoupler circuit outputs in various applications.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Logic IC output optocoupler provides compatibility with logic level signals, making it ideal for digital circuit applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the optocoupler circuit outputs to function effectively even in colder environments.

Maximum Isolation Voltage: 2500 V

High isolation voltage ensures safe operation by providing sufficient insulation between input and output circuits.

Maximum On State Current: 0.008 A

Low on state current helps in reducing power consumption and heat generation, making the product energy-efficient.

Technical Specifications

Optocoupler Circuit Outputs FOD050LSDV attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

2500 V

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Trade Compliance

FOD050LSDV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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