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FGBS3040E1-F085

Onsemi

FGBS3040E1-F085 by Onsemi

FGBS3040E1-F085 by Onsemi is a peripheral driver with a max supply voltage of 28V. It has a small outline package style and can handle a max output current of 19A. This IC type is commonly used as a buffer or inverter based peripheral driver.

Median Price

$4.210

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$2.320

1k+ parts

$2.070

10k+ parts

$1.950

1,600

-

$2.320

$2.070

$1.950

Verical

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$6.100

1k+ parts

$5.463

10k+ parts

$5.138

1,600

-

$6.100

$5.463

$5.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 924 parts In-Stock

1+ parts

$5.158

100+ parts

-

1k+ parts

-

10k+ parts

-

924

$5.158

-

-

-

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$5.582

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$5.582

-

-

-

Chip Stock

USA . 52,000 parts In-Stock

1+ parts

-

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52,000

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-

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Vyrian

USA . 12,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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12,802

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,244 parts In-Stock

1+ parts

$4.620

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$4.620

-

-

-

Corphita

USA . 247 parts In-Stock

1+ parts

$4.887

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$4.887

-

-

-

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$5.430

-

-

-

Continental Prestige Electronics

USA . 2,263 parts In-Stock

1+ parts

$5.582

100+ parts

-

1k+ parts

-

10k+ parts

$5.471

2,263

$5.582

-

-

$5.471

Aztec Data Supply Inc.

USA . 171 parts In-Stock

1+ parts

$9.640

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$9.640

-

-

-

AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$18.070

100+ parts

-

1k+ parts

-

10k+ parts

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647

$18.070

-

-

-

Futuretech Components

Singapore . 20,000 parts In-Stock

1+ parts

-

100+ parts

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20,000

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-

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SupplyDigital Components

Austria . 4,455 parts In-Stock

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4,455

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-

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Argo Parts USA

USA . 3,408 parts In-Stock

1+ parts

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3,408

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TANS Electronics

Latvia . 2,141 parts In-Stock

1+ parts

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2,141

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-

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Kulean Microsystems

USA . 1,051 parts In-Stock

1+ parts

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100+ parts

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1,051

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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UHIMA Technologies

Türkiye . 910 parts In-Stock

1+ parts

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910

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.471

1k+ parts

$5.303

10k+ parts

$5.191

500

-

$5.471

$5.303

$5.191

Microchip USA

USA . 127 parts In-Stock

1+ parts

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100+ parts

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127

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Problanco Electronics

Mexico . 103 parts In-Stock

1+ parts

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103

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-

Overview

Experience the next level of quality and performance with the FGBS3040E1-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures that every product meets the highest standards. The FGBS3040E1-F085 is a powerful peripheral driver that offers unmatched reliability and functionality. Whether you need to control motors, solenoids, or other devices, this product delivers exceptional results. With its compact design and wide range of applications, it's the perfect choice for any project. Trust Onsemi and experience the value, benefits, and advantages that the FGBS3040E1-F085 brings to your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This choice of material provides durability and resistance to environmental factors, making this peripheral driver suitable for various applications.

Surface Mount: YES

With the surface mount capability, this peripheral driver can be easily and securely attached to a circuit board, enhancing reliability and ease of installation.

Maximum Supply Voltage: 28 V

This high maximum supply voltage allows the peripheral driver to be used in a wide range of power supply configurations and applications.

No. of Functions: 1

With a single function, this peripheral driver simplifies circuit design and reduces complexity, making it efficient and cost-effective.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into different system designs, optimizing space utilization.

Maximum Supply Voltage-1: 28 V

Just like the previous spec, the high maximum supply voltage ensures compatibility with a diverse range of power supply setups, making it versatile.

No. of Terminals: 6

With a small number of terminals, this peripheral driver offers simplified connections and ease of integration, improving overall efficiency.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style combined with heat sink/slug capabilities ensures efficient heat dissipation, preventing overheating and enhancing system reliability.

Minimum Supply Voltage-1: 4 V

The low minimum supply voltage allows for flexibility in power supply configurations and enables operation in low voltage applications.

Minimum Supply Voltage: 5 V

This low minimum supply voltage ensures compatibility with a wide range of power sources, making it suitable for various applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of misalignment, ensuring reliable and efficient connections.

Maximum Seated Height: 4.7 mm

The low maximum seated height enables the peripheral driver to be used in compact designs and space-constrained applications.

Width: 9.2 mm

With a narrow width, this peripheral driver can be easily integrated into tight spaces, maximizing board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

This peripheral driver can withstand a high peak reflow temperature for up to 30 seconds, ensuring reliability during the soldering process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability allows for compatibility with lead-free soldering processes, meeting modern environmental requirements.

Length: 9.95 mm

With a compact length, this peripheral driver can be easily integrated into space-constrained designs, optimizing size and layout.

Maximum Output Current: 19 A

The high maximum output current allows for driving high-power devices, making this peripheral driver suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form provides robust electrical connections and facilitates automated surface mount processes, ensuring reliability and ease of manufacturing.

Maximum Supply Current: 5 mA

With a low maximum supply current, this peripheral driver operates with low power consumption, contributing to energy efficiency and prolonged battery life in portable devices.

Turn-on Time: 26 us

The fast turn-on time enables quick response and precise control, enhancing the performance and reliability of the peripheral driver.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this peripheral driver offers compatibility with commonly used connectors, simplifying integration and reducing design constraints.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this peripheral driver can withstand moderate moisture exposure, enhancing its reliability in various environments.

Nominal Output Peak Current Limit: 19 A

The high nominal output peak current limit allows for safe operation of high-power devices, making this peripheral driver suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type provides versatility and flexibility in peripheral driver applications, enabling compatibility with various system configurations.

Turn-off Time: 28 us

The fast turn-off time ensures quick response and accurate control, contributing to the overall efficiency and performance of the peripheral driver.

Output Current Flow Direction: SOURCE

This peripheral driver operates as a source of output current, offering flexibility and compatibility with different circuit configurations.

Technical Specifications

Peripheral Drivers FGBS3040E1-F085 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PSSO-G6

Length:

9.95 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Maximum Output Current:

19 A

Nominal Output Peak Current Limit:

19 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP6/7H,.6,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

4.7 mm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5 V

Maximum Supply Voltage-1:

28 V

Minimum Supply Voltage-1:

4 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

28 us

Turn-on Time:

26 us

Width:

9.2 mm

Trade Compliance

FGBS3040E1-F085 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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