Loading...

FDI025N06

Onsemi

FDI025N06 by Onsemi

FDI025N06 by Onsemi is a Power FET with N-CHANNEL polarity, ideal for SWITCHING applications. It features a 60V DS Breakdown Voltage, 1060A IDM, and 0.0025 ohm RDS(on). With a max power dissipation of 395W and operating temperature of 175 °C, it offers reliable performance in various electronic systems.

Median Price

$2.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$2.840

1k+ parts

$2.540

10k+ parts

$2.390

29

-

$2.840

$2.540

$2.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,775 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

2,775

$3.002

-

-

-

Bristol Electronics

USA . 22 parts In-Stock

1+ parts

$5.152

100+ parts

$2.576

1k+ parts

-

10k+ parts

-

22

$5.152

$2.576

-

-

Vyrian

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 641 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

$0.384

641

$0.400

-

-

$0.384

Northwest PG Solutions

USA . 144 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

-

10k+ parts

$0.388

144

$0.440

-

-

$0.388

Corphita

USA . 2,577 parts In-Stock

1+ parts

$2.844

100+ parts

-

1k+ parts

-

10k+ parts

-

2,577

$2.844

-

-

-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$3.160

-

-

-

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56,986

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,573

-

-

-

-

Kulean Microsystems

USA . 7,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,860

-

-

-

-

SupplyDigital Components

Austria . 7,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,107

-

-

-

-

Microchip USA

USA . 5,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,857

-

-

-

-

TANS Electronics

Latvia . 5,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,818

-

-

-

-

Problanco Electronics

Mexico . 4,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,770

-

-

-

-

Supply Digital

USA . 2,815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,815

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

UHIMA Technologies

Türkiye . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

Perfect Parts

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Overview

Unleash the power of innovation with the FDI025N06 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled performance in switching applications. With a robust design and high-quality materials, this N-CHANNEL transistor provides reliable operation and efficient power management. From enhancing circuit efficiency to maximizing energy savings, this product is a game-changer in the field of electronics. Embrace the future of technology and experience the difference with the FDI025N06 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics such as lower on-resistance and higher current carrying capacity compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage conditions, improving overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in applications like power supplies and motor control.

Minimum DS Breakdown Voltage: 60 V

This high breakdown voltage allows the transistor to handle higher voltage levels without breakdown, providing greater voltage safety margin.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of mounting and compact size, making it suitable for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to the circuit board, ensuring stable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low off-state leakage current, providing energy-efficient operation in switching applications.

Maximum Pulsed Drain Current (IDM): 1060 A

The high pulsed drain current rating allows the transistor to handle short duration high current spikes, making it suitable for demanding transient conditions.

Avalanche Energy Rating (EAS): 2531 mJ

The high avalanche energy rating indicates the transistor's ability to withstand high energy pulses and transient events, improving overall system reliability.

Maximum Drain Current (Abs) (ID): 265 A

The high drain current rating allows the transistor to handle large continuous currents without overheating, ensuring reliable operation in high-power applications.

No. of Terminals: 3

Having three terminals enables easy interfacing with external circuitry, providing flexibility in system design.

Maximum Power Dissipation (Abs): 395 W

The high power dissipation rating allows the transistor to effectively dissipate heat generated during operation, ensuring long-term reliability.

Package Style (Meter): IN-LINE

The in-line package style offers ease of integration into existing circuit designs and allows for efficient board layout, facilitating assembly and maintenance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds, low gate drive requirements, and high input impedance, making it suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures reliable performance in elevated temperature environments, improving overall system robustness.

Transistor Element Material: SILICON

Silicon-based transistors offer high temperature stability, good electrical performance, and long-term reliability, making them ideal for various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Maximum Drain Current (ID): 120 A

The high drain current rating allows the transistor to handle large current flows, ensuring reliable operation in high-power applications.

Maximum Drain-Source On Resistance: 0.0025 ohm

The low on-resistance of the transistor reduces power losses and improves efficiency, making it suitable for high-power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit board layout and facilitates easy connections, improving overall system integration and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDI025N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2531 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

265 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1060 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDI025N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11