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FDH45N50F-F133

Onsemi

FDH45N50F-F133 by Onsemi

FDH45N50F-F133 by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 180A and EAS of 1868mJ, with 0.12 ohm RDS(ON) for efficient operation. Suitable for high-power systems requiring up to 625W dissipation in ENHANCEMENT MODE at temperatures up to 150°C.

Median Price

$7.445

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 27,130 parts In-Stock

1+ parts

$5.426

100+ parts

$4.111

1k+ parts

$3.212

10k+ parts

-

27,130

$5.426

$4.111

$3.212

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Element14

Singapore . 625 parts In-Stock

1+ parts

$6.868

100+ parts

$4.338

1k+ parts

$3.929

10k+ parts

-

625

$6.868

$4.338

$3.929

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Farnell

UK . 625 parts In-Stock

1+ parts

$7.390

100+ parts

$4.797

1k+ parts

$4.240

10k+ parts

-

625

$7.390

$4.797

$4.240

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Mouser Electronics

USA . 1,583 parts In-Stock

1+ parts

$7.500

100+ parts

$3.650

1k+ parts

$3.610

10k+ parts

-

1,583

$7.500

$3.650

$3.610

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Newark

USA . 953 parts In-Stock

1+ parts

$7.500

100+ parts

$5.750

1k+ parts

$4.920

10k+ parts

-

953

$7.500

$5.750

$4.920

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DigiKey

USA . 1,931 parts In-Stock

1+ parts

$7.520

100+ parts

$4.344

1k+ parts

$3.158

10k+ parts

-

1,931

$7.520

$4.344

$3.158

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Chip1Stop

Japan . 27,109 parts In-Stock

1+ parts

$7.920

100+ parts

$3.990

1k+ parts

$3.500

10k+ parts

$3.340

27,109

$7.920

$3.990

$3.500

$3.340

Verical

USA . 25,536 parts In-Stock

1+ parts

-

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25,536

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EBV Elektronik

Germany . 30 parts In-Stock

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30

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$4.550

1k+ parts

$4.070

10k+ parts

$3.830

2

-

$4.550

$4.070

$3.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$3.603

100+ parts

-

1k+ parts

-

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400

$3.603

-

-

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Digiode

USA . 2,369 parts In-Stock

1+ parts

$4.816

100+ parts

-

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-

10k+ parts

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2,369

$4.816

-

-

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Chip Stock

USA . 10,500 parts In-Stock

1+ parts

-

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10,500

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-

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Vyrian

USA . 9,188 parts In-Stock

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9,188

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ComSIT Distribution GmbH

Germany . 1,566 parts In-Stock

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1,566

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IBS Electronics

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

$3.172

1k+ parts

$3.094

10k+ parts

$3.042

1,050

-

$3.172

$3.094

$3.042

NAC Semi

USA . 840 parts In-Stock

1+ parts

-

100+ parts

$4.120

1k+ parts

$3.800

10k+ parts

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840

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$4.120

$3.800

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Flip Electronics

USA . 167 parts In-Stock

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167

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Distributors (Availability)

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Corohmni

South Africa . 51 parts In-Stock

1+ parts

$3.019

100+ parts

-

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51

$3.019

-

-

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Ampacity Inc.

Singapore . 18,761 parts In-Stock

1+ parts

$3.470

100+ parts

-

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18,761

$3.470

-

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Semicontronic

India . 9,408 parts In-Stock

1+ parts

$3.470

100+ parts

$3.383

1k+ parts

$3.366

10k+ parts

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9,408

$3.470

$3.383

$3.366

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Argo Parts USA

USA . 6,932 parts In-Stock

1+ parts

$3.603

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6,932

$3.603

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Netroflash

USA . 2,100 parts In-Stock

1+ parts

$3.603

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2,100

$3.603

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Continental Prestige Electronics

USA . 754 parts In-Stock

1+ parts

$3.603

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$3.531

754

$3.603

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$3.531

Corphita

USA . 1,464 parts In-Stock

1+ parts

$4.563

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1,464

$4.563

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Andel Nordic

Denmark . 5,630 parts In-Stock

1+ parts

$6.752

100+ parts

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$6.481

10k+ parts

$6.481

5,630

$6.752

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$6.481

$6.481

Microchip USA

USA . 8,197 parts In-Stock

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$17.836

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8,197

$17.836

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Lixinc

USA . 15,013 parts In-Stock

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Kepictronics

USA . 12,589 parts In-Stock

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Kulean Microsystems

USA . 7,804 parts In-Stock

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iodParts Technologies Inc.

India . 5,790 parts In-Stock

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GreenTree Electronics

Israel . 3,150 parts In-Stock

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Problanco Electronics

Mexico . 2,898 parts In-Stock

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2,898

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SupplyDigital Components

Austria . 2,524 parts In-Stock

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2,524

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Supply Digital

USA . 1,135 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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TANS Electronics

Latvia . 355 parts In-Stock

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355

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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154

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Overview

Discover the power and efficiency of the FDH45N50F-F133 by Onsemi, a top-tier manufacturer known for their quality products. This N-channel Power FET with a built-in diode is perfect for switching applications, offering a breakthrough in performance and reliability. With a high breakdown voltage of 500V and maximum drain current of 45A, this transistor provides unmatched power dissipation and energy rating. Ideal for various industrial applications, this transistor is a game-changer in enhancing operational efficiency while ensuring long-term durability and stability. Experience the difference with Onsemi's FDH45N50F-F133 - your ultimate solution for power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction makes the FET durable and resistant to heat and moisture, making it ideal for diverse operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better mobility and conductivity, allowing for efficient switching and better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes, enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient performance in controlling power flow.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage levels without breakdown, ensuring reliable operation.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards, saving space and simplifying assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, making installation of the FET hassle-free.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and precision in switching operations, enhancing overall system performance.

Maximum Pulsed Drain Current (IDM): 180 A

The high pulsed drain current capability allows the FET to handle sudden surges in current, ensuring reliable operation in dynamic conditions.

Avalanche Energy Rating (EAS): 1868 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy transients, increasing system resilience.

Maximum Drain Current (Abs) (ID): 45 A

With a maximum drain current of 45 A, this FET can handle substantial current loads, making it suitable for high-power applications.

No. of Terminals: 3

The three terminals provide essential connection points for power and control signals, enabling the FET to function effectively within a circuit.

Maximum Power Dissipation (Abs): 625 W

The high power dissipation rating ensures that the FET can handle heat generated during operation without risking damage, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and thermal management, ensuring optimal performance and reliability in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers excellent performance, reliability, and efficiency in power switching applications, making this FET a robust choice.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can function reliably in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high conductivity and reliability, ensuring stable performance and longevity in various operating conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and conductivity, ensuring secure connections and optimal performance in circuit applications.

Maximum Drain-Source On Resistance: 0.12 ohm

The low drain-source on resistance minimizes power losses and improves efficiency, making this FET suitable for high-performance power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections, ensuring ease of use and reliable performance in various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) FDH45N50F-F133 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1868 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDH45N50F-F133 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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