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FDC5661N

Onsemi

FDC5661N by Onsemi

FDC5661N by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a 20A Max Pulsed Drain Current and 81mJ Avalanche Energy Rating. With a small outline package style and -55 to 150 °C operating temperature range, it offers efficient performance in various electronic designs.

Median Price

$0.302

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,530 parts In-Stock

1+ parts

$0.340

100+ parts

$0.179

1k+ parts

$0.150

10k+ parts

-

2,530

$0.340

$0.179

$0.150

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Mouser Electronics

USA . 1,160 parts In-Stock

1+ parts

$0.580

100+ parts

$0.342

1k+ parts

$0.275

10k+ parts

$0.194

1,160

$0.580

$0.342

$0.275

$0.194

Rochester

USA . 5,349 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.219

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$0.195

5,349

-

$0.263

$0.219

$0.195

Verical

USA . 3,862 parts In-Stock

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$0.244

3,862

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$0.244

Distributors (In-Stock)

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Digiode

USA . 1,921 parts In-Stock

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$0.205

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$0.205

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Vyrian

USA . 1,455 parts In-Stock

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$0.216

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1,455

$0.216

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Cyclops Electronics Ltd

UK . 200,000 parts In-Stock

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Flip Electronics

USA . 2,238 parts In-Stock

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Sensible Micro Corp

USA . 110 parts In-Stock

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110

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Distributors (Availability)

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Native Components

USA . 531 parts In-Stock

1+ parts

$0.118

100+ parts

-

1k+ parts

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$0.113

531

$0.118

-

-

$0.113

Northwest PG Solutions

USA . 1,324 parts In-Stock

1+ parts

$0.129

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$0.114

1,324

$0.129

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$0.114

Corphita

USA . 2,469 parts In-Stock

1+ parts

$0.194

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2,469

$0.194

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Corohmni

South Africa . 164 parts In-Stock

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$0.216

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164

$0.216

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Component Stockers USA

USA . 5,089 parts In-Stock

1+ parts

$0.570

100+ parts

$0.350

1k+ parts

$0.220

10k+ parts

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5,089

$0.570

$0.350

$0.220

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Futuretech Components

Singapore . 33,000 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Kepictronics

USA . 21,886 parts In-Stock

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Kulean Microsystems

USA . 6,874 parts In-Stock

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6,874

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A-Z Elektronik GmbH

Germany . 6,561 parts In-Stock

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6,561

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TANS Electronics

Latvia . 5,405 parts In-Stock

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iodParts Technologies Inc.

India . 4,645 parts In-Stock

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Problanco Electronics

Mexico . 4,382 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,374 parts In-Stock

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SupplyDigital Components

Austria . 2,229 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 622 parts In-Stock

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Overview

Elevate your power systems with the FDC5661N from Onsemi, a top-of-the-line Power Field Effect Transistor designed for high-performance applications. Onsemi's reputation for quality and innovation shines through in this N-CHANNEL transistor, offering enhanced efficiency and reliability. With a single configuration and built-in diode, it's perfect for switching applications where precision is key. Experience seamless operation with the FDC5661N's small outline package, allowing for easy installation and optimal performance. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and thermal resistance, ensuring durability and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and enhances efficiency.

Transistor Application: SWITCHING

Designed for efficient power switching applications.

Minimum DS Breakdown Voltage: 60 V

Suitable for high voltage applications, offering a level of safety and performance.

Maximum Drain Current (ID): 4.3 A

Capable of handling high drain currents for various applications.

Maximum Power Dissipation (Abs): 1.6 W

Efficient power dissipation capability, allowing for reliable operation.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments, offering versatility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for improved performance and efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FDC5661N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

81 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

4.3 A

Maximum Drain Current (ID):

4.3 A

Maximum Drain-Source On Resistance:

.047 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

36 pF

JEDEC-95 Code:

MO-193AA

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.6 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

36 ns

Maximum Turn On Time (ton):

17.6 ns

Trade Compliance

FDC5661N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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